High-K heterostructure
A method for preparing a multilayer substrate includes the step of deposing an epitaxial γ-Al 2 O 3 Miller index (001) layer on a Si Miller index (001) substrate.
1. A semiconductor device comprising a source, a gate, a drain, a well, and a dielectric layer between the well and the gate, wherein said well comprises a Si Miller index (001) substrate portion and the dielectric layer comprises a layer of 10 or less atomic monolayers of γ-Al 2 O 3 Miller index (001) material at least partly covered by a dielectric oxide layer.
2. A semiconductor device according to claim 1 , wherein said dielectric oxide layer is a high-k oxide material.
3. A semiconductor device according to claim 2 , wherein the high-k oxide material comprises crystalline Gd 2 O 3 Miller index (001) material.
4. A semiconductor device according to claim 2 , wherein the high-k oxide material is amorphous.
5. A multilayer substrate comprising a γ-Al 2 O 3 Miller index (001) layer on a Si Miller index (001) layer.
6. The substrate of claim 5 further comprising a dielectric oxide layer on top of the γ-Al 2 O 3 Miller index (001) layer.
7. The substrate of claim 6 wherein the dielectric oxide layer is a high-k oxide layer.
8. The substrate of claim 6 wherein the dielectric oxide layer is crystalline.
9. The substrate of claim 8 wherein the crystalline dielectric oxide layer comprises Gd 2 O 3 Miller index (001) material.
10. The substrate of claim 6 wherein the dielectric oxide layer is amorphous.
11. The substrate of claim 5 wherein the Si Miller index (001) layer supports at least one semiconductor device.
12. The substrate of claim 11 wherein the semiconductor device is a MOS transistor including a dielectric gate oxide layer on top of the γ-Al 2 O 3 Miller index (001) layer.
13. The substrate of claim 5 wherein the γ-Al 2 O 3 Miller index (001) layer is a layer of 10 or less atomic monolayers thickness.