Wire loop forming systems and methods of using the same
A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.
1. A wire bonding system, comprising:
a bond head;
a bonding tool carried by the bond head;
a wire supply configured for bonding by the bonding tool;
a wire shaping tool carried by the bond head, the wire shaping tool being independently moveable with respect to the bonding tool; and
a probe driver for driving the wire shaping tool, wherein the probe driver includes a lever arm attached to the wire shaping tool and affixed to a linearly actuated push rod.
2. The wire bonding system of claim 1 wherein the wire shaping tool is configured for multiple trajectory motions in relation to the bond head.
3. The wire bonding system of claim 2 wherein the wire shaping tool is configured for two trajectory motions in relation to the bond head.
4. The wire bonding system of claim 2 wherein at least one of the multiple trajectory motions causes the wire shaping tool to contact a portion of the wire supply.
5. The wire bonding system of claim 4 wherein the wire shaping tool imparts a bend in the wire supply during contact therebetween.
6. The wire bonding system of claim 5 wherein the imparted bend in the wire supply becomes a second bend in a wire loop proximate a second bonded portion of the wire supply.
7. The wire bonding system of claim 1 wherein the wire shaping tool is controlled according to at least one computer program.
8. The wire bonding system of claim 7 wherein the at least one computer program is configured to provide a desired bend in a wire loop at a point of contact between the wire shaping tool and the wire supply.
9. The wire bonding system of claim 7 wherein the at least one computer program includes computer program instructions to provide one of a plurality of desired bends in a we loop at a point of contact between the wire shaping tool and the wire supply.
10. The wire bonding system of claim 1 wherein at least a portion of the independent movement of the wire shaping tool with respect to the bonding tool is a pivotal movement.
11. The wire bonding system of claim 1 wherein the wire shaping tool is part of a loop forming mechanism of the wire bonding system, the loop forming mechanism including a driving system for providing the independent movement of the wire shaping tool through the probe driver.
12. The wire bonding system of claim 11 wherein the driving system is a linear motor that provides the independent movement of the wire shaping tool.
13. The wire bonding system of claim 1 wherein the wire bonding system is adapted to apply a predetermined force to a portion of the wire supply using the wire shaping tool.
14. The wire bonding system of claim 13 wherein the wire bonding system includes a computer including computer program instructions to apply the predetermined force.
15. The wire bonding system of claim 1 wherein the wire bonding system is adapted to contact a portion of the wire supply using the wire shaping tool moving at a predetermined velocity.
16. The wire bonding system of claim 15 wherein the wire bonding system includes a computer including computer program instructions to move the wire shaping tool at the predetermined velocity.
17. The wire bonding system of claim 1 further comprising a wire guide carried by the bond head.