Organic light emitting diode device and manufacturing method thereof

1. An organic light emitting diode device, comprising:

a substrate;

an organic light emitting diode unit formed on a portion of the substrate; and

a thin film encapsulation layer formed to cover the organic light emitting diode unit,

wherein the thin film encapsulation layer has a multilayered structure in which one or more inorganic layers and one or more organic layers are alternately laminated, a barrier is formed outside of the organic light emitting diode unit on the portion of the substrate,

wherein the barrier contacts the substrate and the one or more inorganic layers, and the organic layers of the thin film encapsulation layer are formed inside an area defined by the barrier, wherein a height of the barrier is higher than a height of the organic light emitting diode unit.

2. The organic light emitting diode device of claim 1 , wherein the organic light emitting diode unit includes a first electrode, an organic emission layer, and a second electrode which are sequentially formed over the portion of the substrate.

3. The organic light emitting diode device of claim 1 , wherein a number of the inorganic layers and the organic layers is between 2 to 20 layers.

4. The organic light emitting diode device of claim 1 , wherein a height of the barrier is equal to or lower than a height of the inorganic layer of the one or more organic layers of the thin film encapsulation layer located furthest from the organic light emitting diode unit.

5. The organic light emitting diode device of claim 1 , wherein a material forming the barrier is an organic material or an inorganic material.

6. The organic light emitting diode device of claim 5 , wherein the organic material includes one or more of: a photoresist, a polyacrylic resin, a polyimide resin, or an acrylic resin.

7. The organic light emitting diode device of claim 5 , wherein the inorganic material includes a silicon compound.

8. A manufacturing method of an organic light emitting diode device, the method comprising:

preparing a substrate;

forming an organic light emitting diode unit on a portion of the substrate;

forming a barrier spaced apart from the organic light emitting diode unit on the portion of the substrate; and

forming a thin film encapsulation layer so as to cover the organic light emitting diode unit,

wherein the forming the thin film encapsulation layer comprises forming a plurality of inorganic layers and forming a plurality of organic layers inside an area defined by the barrier, and

wherein the forming of the organic light emitting diode unit includes:

forming an insulating layer on the portion of the substrate;

forming a pattern of a first electrode on the insulating layer;

forming a pixel defining layer so that the first patterned electrode is partitioned by a pixel unit;

forming an organic emission layer on the first electrode; and

forming a second electrode on the organic emission layer,

wherein the forming the barrier is performed simultaneously with forming the pixel defining layer.

9. The manufacturing method of claim 8 , wherein forming the plurality of inorganic layers and forming the plurality of organic layers are alternately performed 2 to 20 times, respectively.

10. The manufacturing method of claim 8 , wherein a height of the barrier is equal to or higher than a height of the organic layer located furthest away from the organic light emitting diode unit.

11. The manufacturing method of claim 8 , wherein a material forming the barrier is an organic material or an inorganic material.

12. The manufacturing method of claim 11 , wherein the organic material includes at least one of: a photoresist, a polyacrylic resin, a polyimide resin, or an acrylic resin.

13. The manufacturing method of an organic light emitting diode device of claim 11 , wherein the inorganic material includes a silicon compound.