Method for preparing flexible display device
A method for preparing a flexible display device comprises: forming a release layer ( 2 ) on a transparent hard substrate ( 1 ), the release layer ( 2 ) being made of an ultraviolet light decomposition material to which an inert substance is added; integrating a flexible substrate ( 4 ) onto the transparent hard substrate ( 1 ) having the release layer ( 2 ), the flexible substrate ( 4 ) being opposite to a side having the release layer ( 2 ) of the transparent hard substrate ( 1 ); forming a display component ( 5 ) on the flexible substrate ( 4 ); and exposing a side far away from the release layer ( 2 ) of the transparent hard substrate ( 1 ) to ultraviolet rays ( 7 ), so as to trigger the release layer ( 2 ) to undergo a photochemical reaction with gas releasing, so that the transparent hard substrate ( 1 ) is separated from the flexible substrate ( 4 ). The method for preparing a flexible display device can simplify a process of producing a flexible display device.
1. A fabricating method of a flexible display apparatus, comprising steps of: forming a release layer on a transparent rigid substrate, the release layer being made of UV decomposable material doped with inert material, the UV decomposable material is perchloric acid 3(5) amino hydrazine 1, 2, 4-triazolone or perchlorvlamide; attaching a flexible substrate onto the transparent rigid substrate formed with the release layer, the flexible substrate facing the side of the transparent rigid substrate formed with the release layer, the flexible substrate is a yellow flexible substrate; forming display devices on the flexible substrate; and irradiating UV lights on a side of the transparent rigid substrate away from the release layer so as to induce an actinic reaction of the release layer, which release gases to separate the transparent rigid substrate and the flexible substrate.
2. The fabricating method of claim 1 , wherein the step of attaching a flexible substrate onto the transparent rigid substrate formed with the release layer comprises:
applying an adhesive onto the transparent rigid substrate formed with the release layer;
attaching the flexible substrate onto the transparent rigid substrate formed with the adhesive.
3. The fabricating method of claim 1 , wherein
all or part of the inert material is adhesive; and
the step of attaching a flexible substrate onto the transparent rigid substrate formed with the release layer is a step of attaching the flexible substrate directly onto the transparent rigid substrate formed with the release layer.
4. The fabricating method of claim 1 , wherein the inert material is at least one material selected from a group consisting of polyimide, acrylate, silicon dioxide, silicon nitride, zirconium oxide and titanium oxide.
5. The fabricating method of claim 1 , wherein the transparent rigid substrate is a colorless glass substrate or a glass substrate with a color not containing yellow component.
6. The fabricating method of claim 1 , wherein the flexible substrate is made of at least one material selected from a group consisting of polyimide, polyethylene naphthalate, polyethylene terephthalate, fiber reinforced plastic, polyethersulphone, polyarylester and polycarbonate.
7. The fabricating method of claim 2 , wherein the adhesive is a pressure sensitive adhesive or thermal sensitive adhesive.
8. The fabricating method of claim 1 , further comprising a step of cutting the flexible substrate after the step of forming display devices on the flexible substrate and before the step of irradiating UV lights on a side of the transparent rigid substrate away from the release layer so as to induce a actinic reaction of the release layer, which release gases to separate the transparent rigid substrate and the flexible substrate.
9. The fabricating method of claim 2 , wherein
all or part of the inert material is adhesive; and
the step of attaching a flexible substrate onto the transparent rigid substrate formed with the release layer is a step of attaching the flexible substrate directly onto the transparent rigid substrate formed with the release layer.
10. The fabricating method of claim 2 , wherein the transparent rigid substrate is a colorless glass substrate or a glass substrate with a color not containing yellow component.
11. The fabricating method of claim 3 , wherein the transparent rigid substrate is a colorless glass substrate or a glass substrate with a color not containing yellow component.
12. The fabricating method of claim 2 , wherein the inert material is at least one material selected from a group consisting of polyimide, acrylate, silicon dioxide, silicon nitride, zirconium oxide and titanium oxide.
13. The fabricating method of claim 3 , wherein the inert material is at least one material selected from a group consisting of polyimide, acrylate, silicon dioxide, silicon nitride, zirconium oxide and titanium oxide.