RFID integrated circuits with antenna contacts on multiple surfaces
Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.
1. A method of manufacturing a Radio Frequency Identification (RFID) tag, comprising:
providing a tag substrate;
providing a dual-sided Radio Frequency Identification (RFID) integrated circuit (IC) having a first antenna contact on a first surface of the IC and a second antenna contact on a second surface of the IC different from the first surface; and
depositing the IC on the tag substrate such that the first antenna contact electrically connects to a first antenna terminal on the substrate and the second antenna contact is exposed.
2. The method of claim 1 , further comprising providing at least one of a dimple, a through-substrate hole, and a slot configured to at least partially contain the IC.
3. The method of claim 1 , further comprising:
providing a through-substrate hole in the tag substrate, and disposing the first antenna terminal on a back side of the tag substrate, wherein the through-substrate hole and the first antenna terminal form a pocket for the IC.
4. The method of claim 1 , further comprising providing at least one raised region on the substrate for guiding the deposition of the IC.
5. The method of claim 1 , further comprising providing, at a desired IC location, a lower potential energy than at other locations on the tag substrate.
6. The method of claim 1 , wherein depositing the IC comprises dispensing the IC from a bulk dispenser.
7. The method of claim 1 , wherein depositing the IC comprises using at least one of a fluid flow, gravity, and tag substrate vibration to position the IC.
8. A method of manufacturing a Radio Frequency Identification (RFID) tag, comprising:
providing a tag substrate;
providing a dual-sided Radio Frequency Identification (RFID) integrated circuit (IC) having a first antenna contact on a first surface of the IC and a second antenna contact on a second surface of the IC different from the first surface, wherein the IC has an electric charge of a first polarity;
inducing an electric charge of a second polarity different from the first polarity at a location on the tag substrate; and
depositing the charged IC on the tag substrate such that the IC is electrically attracted to the location.
9. The method of claim 8 , further comprising providing at least one of a dimple, a through-substrate hole, and a slot configured to at least partially contain the IC.
10. The method of claim 8 , further comprising:
providing a through-substrate hole in the tag substrate, and disposing the first antenna terminal on a back side of the tag substrate, wherein the through-substrate hole and the first antenna terminal form a pocket for the IC.
11. The method of claim 8 , further comprising using a laser to induce the electric charge of the second polarity at the location.
12. The method of claim 8 , further comprising providing at least one raised region on the tag substrate for guiding the deposition of the IC.
13. The method of claim 8 , further comprising providing, at the location, a lower potential energy than at other locations on the tag substrate.
14. The method of claim 8 , wherein depositing the IC comprises dispensing the IC from a bulk dispenser.
15. The method of claim 8 , wherein depositing the IC further comprises using at least one of fluid flow, gravity, and tag substrate vibration to position the IC.
16. A method of manufacturing a Radio Frequency Identification (RFID) tag, comprising:
providing a tag substrate having an aperture at a location;
providing a dual-sided Radio Frequency Identification (RFID) integrated circuit (IC) having a first antenna contact on a first surface of the IC and a second antenna contact on a second surface of the IC different from the first surface;
providing a gas flow through the aperture by a pressure differential between a front side and a back side of the tag substrate; and
using the gas flow to deposit the IC at the location.
17. The method of claim 16 , further comprising providing at least one of a dimple, a through-substrate hole, and a slot configured to at least partially contain the IC.
18. The method of claim 16 , further comprising:
providing a through-substrate hole at the location, disposing the first antenna terminal on a back side of the tag substrate, and providing the aperture through the first antenna terminal; wherein the through-substrate hole and the first antenna terminal form a pocket for the IC.
19. The method of claim 16 , further comprising providing at least one raised region on the tag substrate for guiding the positioning of the IC.
20. The method of claim 16 , further comprising providing the location with a lower potential energy than other locations on the tag substrate.
21. The method of claim 16 , wherein depositing the IC comprises dispensing the IC from a bulk dispenser.