Semiconductor device, method for manufacturing the same, power supply, and high-frequency amplifier
A semiconductor device includes: a first transistor that includes a first gate electrode, a first source electrode, a first drain electrode, and a first nitride semiconductor laminate that includes a first electron transit layer and a first electron supply layer; a second transistor that includes a second gate electrode, a second source electrode, a second drain electrode, and a second nitride semiconductor laminate that includes a second electrode transit layer and a second electron supply layer, the second drain electrode being a common electrode that also serves as the first source electrode, the second electron transit layer having part that underlies the second gate electrode and that contains a p-type dopant; and a p-type-dopant-diffusion-blocking layer.
1. A semiconductor device comprising:
a first transistor that includes a first gate electrode, a first source electrode, a first drain electrode, and a first nitride semiconductor laminate that includes a first electron transit layer and a first electron supply layer;
a second transistor that includes a second gate electrode, a second source electrode, a second drain electrode, and a second nitride semiconductor laminate that includes a second electrode transit layer and a second electron supply layer, the second drain electrode being a common electrode that also serves as the first source electrode, the second electron transit layer having part that underlies the second gate electrode and that contains a p-type dopant; and
a p-type-dopant-diffusion-blocking layer,
wherein
the second nitride semiconductor laminate is disposed higher than the first nitride semiconductor laminate with the p-type-dopant-diffusion-blocking layer interposed between the first and second nitride semiconductor laminates, and
the first gate electrode and the second source electrode are electrically coupled to each other to establish cascode connection of the first transistor to the second transistor.
2. The semiconductor device according to claim 1 , wherein
the first electron supply layer is thicker than the second electron supply layer.
3. The semiconductor device according to claim 1 , wherein
the distance between the first gate electrode and the first drain electrode is greater than the distance between the first gate electrode and the first source electrode.
4. The semiconductor device according to claim 1 , wherein
the p-type-dopant-diffusion-blocking layer contains any one of AlGaN and AlN having an Al content of not less than 0.5.
5. The semiconductor device according to claim 1 , wherein
the common electrode that serves as the first source electrode and the second drain electrode is formed of the same metal as used for forming the first drain electrode and the second source electrode.
6. The semiconductor device according to claim 1 , wherein
the common electrode that serves as the first source electrode and the second drain electrode is an n-doped region that extends from the surface of the second nitride semiconductor laminate to the first electron transit layer.
7. The semiconductor device according to claim 1 , wherein
the common electrode that serves as the first source electrode and the second drain electrode is an n-type semiconductor layer that extends from the surface of the second nitride semiconductor laminate to the surface of the first nitride semiconductor laminate.
8. The semiconductor device according to claim 1 , wherein
the first electron transit layer contains GaN,
the first electron supply layer contains AlGaN,
the p-type-dopant-diffusion-blocking layer contains any one of AlGaN and AlN,
the second electron transit layer contains GaN and any one of Be, Mg, Fe, and C as the p-type dopant, and
the second electron supply layer contains any one of AlGaN, InAlN, and AlInGaN.
9. A power supply comprising:
a transistor chip that includes
a first transistor that includes a first gate electrode, a first source electrode, a first drain electrode, and a first nitride semiconductor laminate that includes a first electron transit layer and a first electron supply layer;
a second transistor that includes a second gate electrode, a second source electrode, a second drain electrode, and a second nitride semiconductor laminate that includes a second electrode transit layer and a second electron supply layer, the second drain electrode being a common electrode that also serves as the first source electrode, the second electron transit layer having part that underlies the second gate electrode and that contains a p-type dopant; and
a p-type-dopant-diffusion-blocking layer,
wherein
the second nitride semiconductor laminate is disposed higher than the first nitride semiconductor laminate with the p-type-dopant-diffusion-blocking layer interposed between the first and second nitride semiconductor laminates, and
the first gate electrode and the second source electrode are electrically coupled to each other to establish cascode connection of the first transistor to the second transistor.
10. A high-frequency amplifier comprising:
an amplifier that amplifies an input signal, the amplifier including a transistor chip that includes
a first transistor that includes a first gate electrode, a first source electrode, a first drain electrode, and a first nitride semiconductor laminate that includes a first electron transit layer and a first electron supply layer;
a second transistor that includes a second gate electrode, a second source electrode, a second drain electrode, and a second nitride semiconductor laminate that includes a second electrode transit layer and a second electron supply layer, the second drain electrode being a common electrode that also serves as the first source electrode, the second electron transit layer having part that underlies the second gate electrode and that contains a p-type dopant; and
a p-type-dopant-diffusion-blocking layer,
wherein
the second nitride semiconductor laminate is disposed higher than the first nitride semiconductor laminate with the p-type-dopant-diffusion-blocking layer interposed between the first and second nitride semiconductor laminates, and
the first gate electrode and the second source electrode are electrically coupled to each other to establish cascode connection of the first transistor to the second transistor.
11. A method for manufacturing a semiconductor device, the method comprising:
forming a first nitride semiconductor laminate that includes a first electron transit layer and a first electron supply layer, a p-type-dopant-diffusion-blocking layer, and a second nitride semiconductor laminate that includes a second electron transit layer and a second electron supply layer, each layer overlying a semiconductor substrate, the second electron transit layer containing a p-type dopant;
removing part of the second nitride semiconductor laminate corresponding to a region in which a first transistor is to be formed, the first transistor including a first gate electrode, a first source electrode, a first drain electrode, and the first nitride semiconductor laminate;
forming the first drain electrode such that the first drain electrode overlies the first nitride semiconductor laminate in the region in which the first transistor is to be formed and forming a second source electrode such that the second source electrode overlies the second nitride semiconductor laminate in a region in which a second transistor is to be formed, the second transistor including a second gate electrode, the second source electrode, a second drain electrode, and the second nitride semiconductor laminate;
forming a common electrode that serves as the first source electrode and the second drain electrode;
forming the first gate electrode such that the first gate electrode overlies the first nitride semiconductor laminate and forming the second gate electrode such that the second gate electrode overlies the second nitride semiconductor laminate; and
electrically coupling the first gate electrode to the second source electrode to establish cascode connection of the first transistor to the second transistor.
12. The method according to claim 11 , wherein
the first electron supply layer is formed so as to be thicker than the second electron supply layer.
13. The method according to claim 11 , wherein
the first gate electrode, the first drain electrode, and the first source electrode are formed such that the distance between the first gate electrode and the first drain electrode is greater than the distance between the first gate electrode and the first source electrode.
14. The method according to claim 11 , wherein
the p-type-dopant-diffusion-blocking layer is formed of any one of AlGaN and AlN having an Al content of not less than 0.5.
15. The method according to claim 11 , wherein
the common electrode that serves as the first source electrode and the second drain electrode is formed of the same metal as used for forming the first drain electrode and the second source electrode.
16. The method according to claim 11 , wherein
an n-doped region that extends from the surface of the second nitride semiconductor laminate to the first electron transit layer is formed as the common electrode that serves as the first source electrode and the second drain electrode.
17. The method according to claim 11 , wherein
an n-type semiconductor layer that extends from the surface of the second nitride semiconductor laminate to the surface of the first nitride semiconductor laminate is formed as the common electrode that serves as the first source electrode and the second drain electrode.
18. The method according to claim 11 , wherein
the first electron transit layer contains GaN,
the first electron supply layer contains AlGaN,
the p-type-dopant-diffusion-blocking layer contains any one of AlGaN and AlN,
the second electron transit layer contains GaN and any one of Be, Mg, Fe, and C as the p-type dopant, and
the second electron supply layer contains any one of AlGaN, InAlN, and AlInGaN.