Semiconductor device and manufacturing method of semiconductor device
A semiconductor device includes: a first conductivity type transistor and a second conductivity type transistor, wherein each of the first conductivity type transistor and the second conductivity type includes a gate insulating film formed on a base, a metal gate electrode formed on the gate insulating film, and side wall spacers formed at side walls of the metal gate electrode, wherein the gate insulating film is made of a high dielectric constant material, and wherein offset spacers are formed between the side walls of the metal gate electrode and the inner walls of the side wall spacers in any one of the first conductivity type transistor and the second conductivity type transistor, or offset spacers having different thicknesses are formed in the first conductivity type transistor and the second conductivity type transistor.
1. A semiconductor device comprising:
a first conductivity type transistor; and
a second conductivity type transistor,
wherein,
each of the first conductivity type transistor and the second conductivity type transistor includes (i) a gate insulating film on a base, (ii) a metal gate electrode comprising at least a first metal layer and a second metal layer on the gate insulating film, and (iii) side wall spacers of the metal gate electrode,
a distance between one of side walls of the metal gate electrode of the first conductivity type transistor and a corresponding one of the side wall spacers of the metal gate electrode of the first conductivity type transistor is greater than a distance between one of the side walls of the metal gate electrode of the second conductivity type transistor and a corresponding one of the side wall spacers of the metal gate electrode of the second conductivity type transistor,
a gate length of the metal gate electrode of the first conductivity type transistor is different than a gate length of the metal gate electrode of the second conductivity type transistor, and
offset spacers are between the side walls of the metal gate electrode and the side wall spacers of the first conductivity type transistor or the second conductivity type transistor.
2. The semiconductor device according to claim 1 , wherein a distance between the side wall spacers in a gate longitudinal direction of the first conductivity type transistor is equal to a distance between the side wall spacers in the gate longitudinal direction of the second conductivity type transistor.
3. The semiconductor device according to claim 1 , wherein:
a fin-shaped semiconductor layer is on the base,
the offset spacers are provided in the first conductivity type transistor, and
the metal gate electrode of the first conductivity type transistor and the offset spacers of the first conductivity type transistor are disposed over a channel portion of the fin-shaped semiconductor layer.
4. The semiconductor device according to claim 1 , wherein the first and second metal layers of the metal gate electrode of the first conductivity type transistor include a buried metal layer and a work function (WF) metal layer.
5. The semiconductor device according to claim 1 , wherein the first and second metal layers of the metal gate electrode of the second conductivity type transistor include a buried metal layer and a work function (WF) metal layer.
6. The semiconductor device according to claim 1 , wherein the gate length of the metal gate electrode of the first conductivity type transistor is less than the gate length of the metal gate electrode of the second conductivity type transistor.
7. The semiconductor device of claim 1 , wherein the gate insulating film comprises a material having a higher dielectric constant than that of silicon oxide.
8. The semiconductor device of claim 1 , wherein:
the offset spacers are provided in the first conductivity type transistor between the side walls of the metal gate electrode and the side wall spacers, and
the second conductivity type transistor has its gate insulating film in contact with its side wall spacers.
9. A semiconductor device comprising:
a first transistor including (a) a first gate insulating film on a base, (b) a first metal gate electrode comprising at least a first metal layer and a second metal layer on the first gate insulating film, (c) first side wall spacers on the base, and (d) offset spacers between side walls of the first metal gate electrode and the first side wall spacers; and
a second transistor including (a) a second gate insulating film on the base, (b) a second metal gate electrode comprising at least a first metal layer and a second metal layer on the second gate insulating film, and (c) second side wall spacers on the base,
wherein,
a distance between one of the side walls of the first metal gate electrode of the first transistor and a corresponding one of the first side wall spacers of the first transistor is greater than a distance between one of side walls of the second metal gate electrode of the second transistor and a corresponding one of the second side wall spacers of the second transistor,
a gate length of the first metal gate electrode of the first transistor is different than a gate length of the second metal gate electrode of the second transistor, and
a conductivity-type of the first transistor is different than a conductivity-type of the second transistor.
10. The semiconductor device according to claim 9 , wherein:
the first transistor is a p-type field effect transistor,
the second transistor is an n-type field effect transistor, and
the gate length of the first metal gate electrode of the first transistor is less than the gate length of the second metal gate electrode of the second transistor.
11. The semiconductor device according to claim 9 , wherein the gate length of the first metal gate electrode is less than the gate length of the second metal gate electrode.