Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically interconnected to the conductive layer.
1. A device comprising:
a first substrate layer;
a metallization layer formed on a surface of the first substrate layer, wherein the metallization layer comprises a first slot to expose a portion of the first substrate layer; wherein the metallization layer acts as an antenna and a sealing cover for an item within a packaging;
a radio frequency identification (RFID) chip over the portion of the first substrate layer;
a conductive layer which couples the RFID chip to the metallization layer,
wherein the first slot in the metallization layer determines the antenna configuration for the RFID chip.
2. The device of claim 1 wherein the antenna configuration is selected from a group consisting of loop, circular, straight, curved, folded, and dipole.
3. The device of claim 1 wherein the RFID chip is deposited in a second substrate having a receptor configured to receive the RFID chip and wherein the second substrate is adhered to the first substrate layer.
4. The device of claim 1 , wherein the metallization layer has a second slot to provide a resonator for the RFID chip.
5. The device of claim 1 , wherein the conductive layer comprises one or more conductive pads.
6. The device of claim 1 further comprising a conductive interconnect coupled to the conductive layer that acts as a resonator for the RFID chip.
7. The device of claim 1 wherein the packaging is at least one of a Blister Pack tray or a bottle.
8. A method for creating a device comprising:
forming a first slot in a metallization layer to expose a portion of a surface of a first substrate layer; wherein the metallization layer acts as an antenna and a sealing cover for an item within a packaging;
depositing a radio frequency identification (RFID) chip over the portion of the first substrate layer;
coupling the RFID chip to the metallization layer by a conductive layer which extends from the RFID chip to the metallization layer, wherein the first slot in the metallization layer determines the antenna configuration for the RFID chip.
9. The method of claim 8 wherein the antenna configuration is selected from a group consisting of loop, circular, straight, curved, folded, and dipole.
10. The method of claim 8 further comprising:
placing a cap layer over the conductive layer and the RFID chip.
11. The method of claim 8 further comprising:
recessing the RFID chip into a second substrate; and
coupling the second substrate to the first substrate layer.
12. The method of claim 8 wherein the first slot in the metallization layer is formed using a cutting tool.
13. The method of claim 8 further comprising
forming a second slot in the metallization layer to provide a resonator for the RFID chip.
14. The method of claim 8 further comprising
coupling the RFID chip to the metallization layer at two sides of the first slot.
15. The method of claim 8 , wherein the conductive layer comprises one or more conductive pads.
16. The device of claim 1 , wherein the first slot extends to an edge of the metallization layer.
17. The device of claim 1 , wherein the item is deposited between the first substrate layer and the metallization layer.
18. The device of claim 1 , further comprising
a cap layer over the RFID chip.
19. The method of claim 8 , wherein the packaging is at least one of a Blister Pack tray or a bottle.
20. The method of claim 8 , further comprising
forming a conductive interconnect to couple to the conductive layer to act as a resonator for the RFID chip.