IP Library Granted Patent US 9,076,521
Granted Patent B2
US 9,076,521 · App. 13/549,436 · Granted Jul 7, 2015

Method and apparatus for decoding memory

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Quick Facts
Patent No.
US 9,076,521
App. No.
13/549,436
Granted
Jul 7, 2015
Kind
B2
Abstract

A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller.

Claims (45)

1. An apparatus comprising:

a first conductive line;

a memory cell directly connected to said first conductive line, said memory cell consisting essentially of a memory element and an ovonic threshold switch (OTS) device;

a first reverse-biased diode directly coupled to said memory cell, said first reverse-biased diode being directly connected to said first conductive line at a first position along said first conductive line, said first reverse biased diode not being contained within a transistor; and

a second reverse-biased diode directly coupled to said memory cell, said second reverse-biased diode being directly connected to said first conductive line at a second position along said first conductive line, said second position differing from said first position.

2. The apparatus of claim 1 , wherein said memory cell and said first reverse-biased diode are coupled in series.

3. The apparatus of claim 1 , wherein said OTS device is a thin-film device.

4. The apparatus of claim 1 , wherein said first reverse-biased diode is a thin-film diode.

5. The apparatus of claim 4 , wherein said thin-film diode comprises silicon.

6. The apparatus of claim 1 , a wherein said memory element is coupled to said OTS device.

7. The apparatus of claim 6 , wherein said memory element is a thin-film memory element.

8. The apparatus of claim 6 , wherein said memory element comprises a phase-change material.

9. The apparatus of claim 6 , wherein said memory element comprises a chalcogenide material.

10. The apparatus of claim 6 , wherein said memory element comprises a variable resistance material.

11. The apparatus of claim 1 , further comprising a first power supply, said first power supply coupled to said memory cell.

12. The apparatus of claim 11 , further comprising a second conductive line, said memory cell coupled between said first power supply and said second conductive line.

13. The apparatus of claim 12 , further comprising a third reverse-biased diode, said third reverse-biased diode coupled to said second conductive line.

14. The apparatus of claim 13 , further comprising a second OTS device, said second OTS device coupled to said second conductive line.

15. The apparatus of claim 14 , further comprising a second power supply, said second OTS device coupled between said second conductive line and said second power supply.

16. The apparatus of claim 13 , wherein said third reverse-biased diode is directly connected to said second conductive line.

17. The apparatus of claim 16 , further comprising a fourth reverse-biased diode directly connected to said second conductive line, said third reverse-biased diode and said fourth reverse-biased diode directly connecting said second conductive line at different positions.

18. The apparatus of claim 1 , wherein said second reverse biased diode is not contained within a transistor.

19. An apparatus comprising:

a first conductive line;

a memory cell directly connected to said first conductive line, said memory cell consisting essentially of a memory element and an ovonic threshold switch (OTS) device;

a first reverse-biased diode directly coupled to said memory cell, said first reverse-biased diode being directly connected to said first conductive line at a first position along said first conductive line; and

a second reverse-biased diode directly coupled to said memory cell, said second reverse-biased diode being directly connected to said first conductive line at a second position along said first conductive line, said second position differing from said first position;

wherein said apparatus lacks direct connection of a transistor to said first position.

20. The apparatus of claim 19 , wherein said apparatus lacks direction connection of a transistor to said second position.

21. The apparatus of claim 19 , wherein said memory cell and said first reverse-biased diode are coupled in series.

22. The apparatus of claim 19 , wherein said OTS device is a thin-film device.

23. The apparatus of claim 19 , wherein said first reverse-biased diode is a thin-film diode.

24. The apparatus of claim 23 , wherein said thin-film diode comprises silicon.

25. The apparatus of claim 19 , a wherein said memory element is coupled to said OTS device.

26. The apparatus of claim 25 , wherein said memory element is a thin-film memory element.

27. The apparatus of claim 25 , wherein said memory element comprises a phase-change material.

28. The apparatus of claim 25 , wherein said memory element comprises a chalcogenide material.

29. The apparatus of claim 25 , wherein said memory element comprises a variable resistance material.

30. The apparatus of claim 19 , further comprising a first power supply, said first power supply coupled to said memory cell.

31. The apparatus of claim 30 , further comprising a second conductive line, said memory cell coupled between said first power supply and said second conductive line.

32. The apparatus of claim 31 , further comprising a third reverse-biased diode, said third reverse-biased diode coupled to said second conductive line.

33. The apparatus of claim 32 , further comprising a second OTS device, said second OTS device coupled to said second conductive line.

34. The apparatus of claim 33 , further comprising a second power supply, said second OTS device coupled between said second conductive line and said second power supply.

35. The apparatus of claim 32 , wherein said third reverse-biased diode is directly connected to said second conductive line.

36. The apparatus of claim 35 , further comprising a fourth reverse-biased diode directly connected to said second conductive line, said third reverse-biased diode and said fourth reverse-biased diode directly connecting said second conductive line at different positions.

Assignments (3)
CHANGE OF NAME Recorded Jul 18, 2016
From: CARLOW INNOVATIONS, LLC
To: OVONYX MEMORY TECHNOLOGY, LLC
Reel/Frame 039379/0077 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2015
From: OVONYX, INC.
To: CARLOW INNOVATIONS LLC
Reel/Frame 037244/0954 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2012
From: PARKINSON, WARD
To: OVONYX, INC.
Reel/Frame 028551/0110 →