IP Library Granted Patent US 9,079,220
Granted Patent B2
US 9,079,220 · App. 13/804,872 · Granted Jul 14, 2015

Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device

Inventors: Tomoaki Nakamura (Nagano, JP); Jiro Tsuruno (Nagano, JP); Kanechika Kiyose (Nagano, JP)
Assignee: Seiko Epson Corporation
B06B1/0622G03B42/06
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Quick Facts
Patent No.
US 9,079,220
App. No.
13/804,872
Granted
Jul 14, 2015
Kind
B2
Abstract

An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements, a reinforcing member and a ventilation passage. The substrate defines a plurality of openings arranged in an array pattern. The ultrasonic transducer elements are respectively disposed at the openings on a first surface of the substrate. The reinforcing member is fixed on a second surface of the substrate opposite to the first surface of the substrate to reinforce the substrate. Through the ventilation passage, internal spaces of the openings and an external space of the substrate are in communication with each other.

Claims (27)

1. An ultrasonic transducer element chip comprising:

a substrate defining a plurality of openings arranged in an array pattern;

a plurality of ultrasonic transducer elements respectively disposed at the openings on a first surface of the substrate;

a reinforcing member fixed on a second surface of the substrate opposite to the first surface of the substrate to reinforce the substrate; and

a ventilation passage through which internal spaces of the openings and an external space of the substrate are in communication with each other.

2. The ultrasonic transducer element chip according to claim 1 , wherein

the reinforcing member is bonded to a partition wall section of the substrate between the openings in at least one bonding region.

3. The ultrasonic transducer element chip according to claim 1 , wherein

the reinforcing member includes a first surface overlaid on the second surface of the substrate, and the ventilation passage includes a plurality of groove parts formed on the first surface of the reinforcing member.

4. The ultrasonic transducer element chip according to claim 1 , wherein

the ventilation passage includes a plurality of groove parts formed on the second surface of the substrate.

5. The ultrasonic transducer element chip according to claim 1 , wherein

at least a portion of one of the substrate and the reinforcing member is made of a porous material, and

the ventilation passage includes a plurality of pores of the porous material.

6. A probe comprising:

the ultrasonic transducer element chip according to claim 1 ; and

a case member supporting the ultrasonic transducer element chip.

7. An electronic instrument comprising:

the probe according to claim 6 ; and

a processing circuit connected to the probe, and configured to process output signals of the ultrasonic transducer elements.

8. An ultrasonic diagnostic device comprising:

the probe according to claim 6 ;

a processing circuit connected to the probe, and configured to process output signals of the ultrasonic transducer elements to generate an image; and

a display device configured to display the image.

9. A probe head comprising:

the ultrasonic transducer element chip according to claim 1 ; and

a case member supporting the ultrasonic transducer element chip, and configured to be coupled to a probe main body of a probe.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2013
From: NAKAMURA, TOMOAKI; TSURUNO, JIRO; KIYOSE, KANECHIKA
To: SEIKO EPSON CORPORATION
Reel/Frame 029998/0208 →
Priority Claims (1)
JP 2012-078672 · Mar 30, 2012 · national
Continuity (1)
Related Publication 20130258803A1 · Oct 3, 2013