Flexible multi-moduled nanoparticle-structured sensor array on polymer substrate and methods for manufacture
A flexible chemiresistor (CR) sensor for sensing a molecule of interest in a fluid (liquid or gas) is provided. The flexible CR sensor comprises a flexible chemiresistor (CR) module. The flexible CR module comprises a flexible substrate such polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or polyimide (PI), and a thin film nanoparticle assembly assembled on the flexible substrate. The thin film nanoparticle assembly comprises metal or metal alloy core, ligand-capped nanoparticles and molecular linkers connecting the nanoparticles. The flexible CR sensor and an intelligent pattern recognition engine can be incorporated in a handheld device that can detect a molecule of interest in a fluid (e.g., a liquid or gas) accurately, rapidly, and without false positives. Any sensing array nanomaterial, pattern recognition, and compact/or electronic hardware can be integrated to achieve a desired detection limit and response speed.
1. A flexible chemiresistor module for sensing a molecule of interest, said flexible chemiresistor module comprising:
a flexible substrate; and
a thin film nanoparticle assembly disposed on the flexible substrate, said thin film nanoparticle assembly comprising:
metal or metal alloy core, ligand-capped nanoparticles comprising a nanoparticle capping ligand,
molecular linkers connecting adjacent ones of the metal or metal alloy core, ligand-capped nanoparticles, the molecular linkers comprising mercaptocarboxylic acid with a carboxyl end forming hydrogen bonds with the metal or metal alloy core, ligand-capped nanoparticles, and
a plurality of microelectrodes coupled to one or more of the metal or metal alloy core, ligand-capped nanoparticles,
wherein the flexible substrate and the thin film nanoparticle assembly are configured to bend from a first orientation to a second orientation, which is different than the first orientation,
wherein the thin film assembly adheres to the flexible substrate via hydrophobic interaction between the flexible substrate and the nanoparticle capping ligand of the ligand-capped nanoparticles,
wherein the first orientation is planar and the second orientation configures the substrate and the thin film nanoparticle assembly to conformally adapt to a cylinder of a defined diameter by convex bending and concave bending, and
wherein the thin film nanoparticle assembly is configured to maintain chemical sensitivity in response to exposure to the molecule of interest to induce an electrical signal across the plurality of microelectrodes in the second orientation.
2. The flexible chemiresistor module of claim 1 , wherein the flexible substrate comprises polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyimide (PI).
3. The flexible chemiresistor module of claim 1 , wherein the metal or metal alloy core comprises one or more of gold, silver, platinum, iron oxide, gold-silver alloy, gold-platinum alloy, gold-copper alloy, and mixtures thereof.
4. The flexible chemiresistor module of claim 1 , wherein the thin film nanoparticle assembly comprises particles with a particle radius (r) of 1 to 50 nm.
5. The flexible chemiresistor module of claim 1 , wherein the molecule of interest is a volatile organic compound (VOC) selected from the group consisting of acetone, toluene, benzene hexane, heptane, octane, iso-octane, cyclohexane, chloroform, tetrahydrofuran, ethyl acetate, methanol, ethanol, isopropanol, butanol, nitrobenzene and xylenes.
6. The flexible chemiresistor module of claim 1 , wherein the nanoparticle capping ligand comprises one or more of alkanethiols, alkyl amines, alkyl alcohols, alkanoic acids, and mixtures thereof.
7. The flexible chemiresistor module of claim 6 , wherein the nanoparticle capping ligand differ by size, material, or chemical structure on one or more of the metal or metal alloy core, ligand-capped nanoparticles.
8. The flexible chemiresistor module of claim 6 , wherein the nanoparticle capping ligand comprises decanethiol.
9. The flexible chemiresistor module of claim 1 , wherein the metal or metal alloy core, ligand-capped nanoparticles differ by size or material.
10. The flexible chemiresistor module of claim 1 , wherein the molecular linkers differ by length, chemical content, or chemical structure.
11. The flexible chemiresistor module of claim 10 , wherein the molecular linkers further comprise α,ω-alkyldithiols.
12. The flexible chemiresistor module of claim 11 , wherein the electrical signal corresponds with an electrical property that can be configured by the degree and direction of bending as between the first orientation and the second orientation.