IP Library Granted Patent US 9,088,071
Granted Patent B2
US 9,088,071 · App. 13/303,135 · Granted Jul 21, 2015

Techniques for conductive particle based material used for at least one of propagation, emission and absorption of electromagnetic radiation

Inventors: Rhett Francis Spencer (Heber City, UT); Eric Guzman Hernandez (Tampa, FL); Anthony Joseph Sutera (Draper, UT)
Assignee: ChamTech Technologies, Incorporated
H01Q1/364H01Q1/38H01Q17/004Y10T29/49016
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Quick Facts
Patent No.
US 9,088,071
App. No.
13/303,135
Granted
Jul 21, 2015
Kind
B2
Abstract

An antenna system and method for fabricating an antenna are provided. The antenna system includes a substrate and an antenna. The antenna includes a conductive particle based material applied onto the substrate. The conductive particle based material includes conductive particles and a binder. When the conductive particle based material is applied to the substrate, the conductive particles are dispersed in the binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another.

Claims (24)

1. An antenna system comprising:

a substrate; and

a radiating antenna element formed of a conductive particle based material comprising conductive particles dispersed in a binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another,

wherein the substrate is disposed in a first layer and the radiating antenna element is disposed in a second layer that is substantially parallel to the first layer,

wherein the conductive particle based material is applied directly onto, and without encircling, the substrate, and

wherein a portion of the substrate onto which the conductive particle based material is applied directly is non-conductive, and another portion of the substrate onto which the conductive particle based material is applied directly is conductive.

2. The antenna system of claim 1 , wherein the conductive portion of the substrate at least one of electrically, capacitively, and inductively couples to the radiating antenna element, and electrically couples to a feed line.

3. The antenna system of claim 1 , wherein, when a Radio Frequency (RF) signal is input to the radiating antenna element, a reverse power is lower than the reverse power of an identically formed antenna element fabricated from copper.

4. The antenna system of claim 1 , wherein the conductive particles comprise at least one of conductive particles of different non-uniform shapes, conductive particles of various sizes, or conductive particles smaller than 30 micrometers.

5. The antenna system of claim 1 , wherein the conductive particle based material is applied to the substrate as at least one of a liquid, a paint, a gel, an ink and a paste that dries or cures.

6. The antenna system of claim 1 , wherein at least a portion of the non-conductive portion of the substrate is disposed between a conductive material and the radiating antenna element.

7. The antenna system of claim 1 , wherein the substrate comprises a ground plane for the radiating antenna element.

8. The antenna system of claim 1 , further comprising at least one of a protective and concealment coating applied to the radiating antenna element.

9. The antenna system of claim 1 , wherein the radiating antenna element is fed a Radio Frequency (RF) signal amplified by an amplifier that operates for less than an entire input cycle.

10. The antenna system of claim 9 , wherein the amplifier comprises a class C amplifier.

11. The antenna system of claim 1 , wherein the radiating antenna element is also a receiving antenna element.

12. An antenna enhancer comprising:

an antenna enhancer element formed of a conductive particle based material, the antenna enhancer element being disposed at an area of an inner side of a housing of a wireless device that is adjacent to at least one of an internal radiating or receiving antenna,

wherein the housing of a wireless device is formed of a conductive material,

wherein a non-conductive material is disposed between the antenna enhancer element and the at least one of the radiating or receiving antenna, and

wherein the conductive particle based material comprises conductive particles dispersed in a binder so that at least a majority of the conductive particles are adjacent to, but do not touch, one another.

13. The antenna enhancer of claim 12 , wherein the antenna enhancer element and the at least one of the radiating or receiving antenna element are at least one of inductively and capacitively coupled.

14. The antenna enhancer of claim 12 , wherein, when a Radio Frequency (RF) signal is input to the at least one of the radiating or receiving antenna, a reverse power is lower than the reverse power of the at least one of the radiating or receiving antenna element without the antenna enhancer element.

15. The antenna enhancer of claim 12 , wherein the conductive particles comprise at least one of conductive particles of different non-uniform shapes, conductive particles of various sizes, or conductive particles smaller than 30 micrometers.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2016
From: CHAMTECH TECHNOLOGIES INCORPORTED
To: NCAP HOLDINGS, LLC
Reel/Frame 040314/0047 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2016
From: NCAP HOLDINGS, LLC
To: NCAP LICENSING, LLC
Reel/Frame 040314/0063 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2011
From: SPENCER, RHETT FRANCIS; HERNANDEZ, ERIC GUZMAN; SUTERA, ANTHONY JOSEPH
To: CHAMTECH TECHNOLOGIES INCORPORATED
Reel/Frame 027311/0166 →
Continuity (5)
Provisional Application 61416093 · Nov 22, 2010
Provisional Application 61473726 · Apr 8, 2011
Provisional Application 61477587 · Apr 20, 2011
Provisional Application 61514435 · Aug 2, 2011
Related Publication 20120146855A1 · Jun 14, 2012