IP Library Granted Patent US 9,090,751
Granted Patent B2
US 9,090,751 · App. 13/383,469 · Granted Jul 28, 2015

Thermally conductive thermoplastic resin compositions and related applications

Inventors: Yuji Saga (Utsunomiya, JP); Narumi Une (Utsunomiya, JP)
Assignee: Ticona LLC
C08K3/0008C08K7/04C09K19/02C09K19/3809C09K19/52H05K7/20481
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Quick Facts
Patent No.
US 9,090,751
App. No.
13/383,469
Granted
Jul 28, 2015
Kind
B2
Abstract

Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility and is suitable for fabricating a chassis for LCD display. Also described are the thermally conductive resin compositions, especially when the polymer is LCP. Such compositions are useful for items such as electrical and electronic housings requiring highly thermally conduciveness.

Claims (15)

1. A composition comprising liquid crystalline polymer, in an amount between about 15 and about 75 weight percent of the composition; thermally conductive filler having a thermal conductivity of at least 5 W/mK, in an amount between about 25 and about 85 weight percent of the composition, wherein said thermally conductive filler is at least one selected from the group consisting of calcium fluoride, magnesium oxide, magnesium carbonate, boehmite and zinc sulfide, wherein the thermally conductive filler has an average particle size between 1 micron and 100 microns; and at least one fibrous filler having a thermal conductivity of at most 5 W/mK, in an amount between about 5 and about 30 weight percent of the composition, wherein the fibrous filler comprises wollastonite, glass fibers, glass flakes, aluminum borate fibers, calcium carbonate fibers, or potassium titanate fibers, further wherein said composition has a volume resistivity that is larger than 1×10 10 ohm·cm.

2. The composition of claim 1 , wherein said fibrous filler is a glass fiber.

3. The composition of claim 2 , wherein said composition has a flexural modulus that is larger than 10 Gpa.

4. The composition of claim 1 , having a flame retardancy that can be classified as V-0 at 1.6 mm thickness according to the UL94 flaming test.

5. The composition of claim 1 , wherein said composition has a flame retardancy that can be classified as V-0 at 1.6 mm thickness in the UL94 flaming test.

6. The composition of claim 1 , wherein said liquid crystalline polymer comprises an aromatic polyester.

7. The composition of claim 1 , wherein said liquid crystalline polymer is present in an amount between about 25 and about 50 weight percent of the composition.

8. The composition of claim 1 , wherein said thermally conductive filler has a thermal conductivity of at least 10 W/mK.

9. The composition of claim 1 , wherein said thermally conductive filler is present in an amount between about 40 and about 70 weight percent of the composition.

10. The composition of claim 1 , wherein said thermal conductivity of said at least one fibrous filler is about 1 W/mk to at most 5 W/mK.

11. The composition of claim 1 , wherein said composition comprises 5 to 30 weight percent of the at least one fibrous filler.

12. The composition of claim 1 , wherein said at least one fibrous filler has a weight average aspect ratio of at least 5.

13. The composition of claim 1 , further comprising a polymeric toughening agent.

14. The composition of claim 13 , wherein said polymeric toughening agent comprises a terpolymer derived from ethylene, butyl acrylate, and glycidyl methacrylate.

15. The composition of claim 13 , where said polymeric toughening agent is present in an amount between about 2 and about 15 weight percent of the composition.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 028698 FRAME 0339. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE. Recorded Aug 3, 2012
From: SAGA, YUJI; UNE, NARUMI
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 028717/0654 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2012
From: SAGA, YUJI; UNE, NARUMI
To: TICONA LLC
Reel/Frame 028698/0339 →
Continuity (2)
Provisional Application 61228166 · Jul 24, 2009
Related Publication 20130003416A1 · Jan 3, 2013