IP Library Granted Patent US 9,090,796
Granted Patent B2
US 9,090,796 · App. 13/671,614 · Granted Jul 28, 2015

Organic-inorganic composite materials containing triazine rings and electrical devices using the same

Inventors: Tomokazu Tanase (Hitachinaka, JP); Hiroyuki Kagawa (Hitachiaka, JP); Satoru Amou (Hitachi, JP)
Assignee: Hitachi, Ltd.
C09D167/00C08G73/0644C08G73/0655C08G73/0661C08K3/346C08K5/17C08K9/04C08L79/04C09D7/1225C09D7/1291C09D179/04B82Y30/00C08K5/0091H01B3/303H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265
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Quick Facts
Patent No.
US 9,090,796
App. No.
13/671,614
Granted
Jul 28, 2015
Kind
B2
Abstract

The present invention provides an organic-inorganic composite material having excellent thermal stability, electrical insulation and adhesiveness. The organic-inorganic composite material includes a resin composed of a triazine ring and obtained by thermally curing a varnish containing a mixture of a layered clay mineral (clay) subjected to interlayer modification with a curing catalyst for a cyanate ester compound and a cyanate ester compound, wherein the amount of the clay is from 0.1 to 12 wt % of the amount of the cyanate ester compound. The invention also provides a varnish which gives the organic-inorganic composite material, and an electrical device and a semiconductor device, each of which includes the organic-inorganic composite material.

Claims (20)

1. An organic-inorganic composite material, comprising a resin composed of a triazine ring and a thermally cured varnish containing a mixture of a layered clay mineral (clay) subjected to interlayer modification with a metallic complex of amine and a cyanate ester compound,

wherein the amount of the clay is from 0.1 to 12 wt % of the amount of the cyanate ester compound, and

the clay in the organic-inorganic composite material is in the form of a flake having a thickness of 0.05 to 10 μm and the length on one side of the flake is from 1 to 50 μm, and

wherein the organic-inorganic composite material has a thickness of 0.005 to 0.1 mm.

2. The organic-inorganic composite material according to claim 1 , wherein the metallic complex of amine includes as a ligand one member selected from the group consisting of an aliphatic amine, a heteroaromatic amine and an aromatic amine.

3. The organic-inorganic composite material according to claim 1 , wherein the clay is at least one member selected from the group consisting of a smectite group, a mica group, a vermiculite group and a mica family group.

4. The organic-inorganic composite material according to claim 1 , wherein an interlayer distance of the clay is from 1.2 to 2 nm.

5. The organic-inorganic composite material according to claim 1 , wherein a transition metal comprising of the metallic complex is at least one element selected from copper, zinc and manganese.

6. The organic-inorganic composite material according to claim 5 , wherein the amount of the transition metallic complex is from 0.1 to 30 wt % of the amount of the clay.

7. The organic-inorganic composite material according to claim 5 , wherein the amount of the transition metal element is from 0.01 to 10 wt % of the amount of the organic-inorganic composite material.

8. The organic-inorganic composite material according to claim 1 , wherein the organic-inorganic composite material has a glass transition temperature of 200° C. or higher, an adhesive strength of 0.5 kN/m or more and an electrical breakdown strength of 150 kV/mm or more.

9. An electrical device, comprising an organic-inorganic composite material, which is in contact with a metal and includes a resin composed of a triazine ring and a thermally cured varnish containing a mixture of a layered clay mineral (clay) subjected to interlayer modification with a metallic complex of amine and a cyanate ester compound,

wherein the amount of the clay is from 0.1 to 12 wt % of the amount of the cyanate ester compound, and the clay in the organic-inorganic composite material is in the form of a flake having a thickness of 0.05 to 10 μm and the length on one side of the flake is from 1 to 50 μm, and

wherein the organic-inorganic composite material has a thickness of 0.005 to 0.1 mm.

10. A semiconductor device, which has a structure in which the circumference of a semiconductor element is sealed by a sealant, wherein as the sealant, the organic-inorganic composite material according to claim 1 is used.

11. A varnish, comprising a mixture of a layered clay mineral (clay) subjected to interlayer modification with a metallic complex of amine and a cyanate ester compound, wherein the amount of the clay is from 0.1 to 12 wt % of the amount of the cyanate ester compound, and the clay is in the form of a flake having a thickness of 0.05 to 10 μm and the length on one side of the flake is from 1 to 50 μm,

wherein the varnish is used in the organic-inorganic composite material according to claim 1 , and said thickness of the clay is measured in the organic-inorganic composite material.

12. The varnish according to claim 11 , wherein the cyanate ester compound is 4,4′-ethylidenediphenyldicyanate, the clay is montmorillonite, and in an interlayer space of the montmorillonite, a metallic complex containing 1,3-propanediamine as a ligand is intercalated.

13. An electrical wire, which is obtained by coating the circumference of a conductor with an insulating material, wherein as the insulating material, the organic-inorganic composite material according to claim 1 is used.

14. A rotor coil, which is obtained by impregnating a conductor with an insulating material wound therearound with a resin, wherein as the resin used in the impregnation, the organic-inorganic composite material according to claim 1 is used.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2013
From: TANASE, TOMOKAZU; KAGAWA, HIROYUKI; AMOU, SATORU
To: HITACHI, LTD.
Reel/Frame 029750/0133 →
Priority Claims (2)
JP 2011254926 · Nov 22, 2011 · national
JP 2012135584 · Jun 15, 2012 · national
Continuity (1)
Related Publication 20130131248A1 · May 23, 2013