IP Library Granted Patent US 9,096,936
Granted Patent B2
US 9,096,936 · App. 14/174,771 · Granted Aug 4, 2015

Metal structural body-containing polymer film, method for manufacturing metal structural body-containing polymer film, and method for manufacturing patterned structural body

Inventors: Wataru Kubo (Inagi, JP); Kazuhiro Yamauchi (Suntou-gun, JP); Kenji Yamada (Yokohama, JP); Mamiko Kumagai (Yokohama, JP); Kyoko Kumagai (Toyota, JP); Toshiki Ito (Kawasaki, JP); Norishige Kakegawa (Chofu, JP)
Assignee: Canon Kabushiki Kaisha
C23F1/00B32B15/08C25D5/02C25D13/04B41M3/00Y10T428/24917
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Quick Facts
Patent No.
US 9,096,936
App. No.
14/174,771
Granted
Aug 4, 2015
Kind
B2
Abstract

A method for manufacturing a patterned structural body by which a patterned structural body having a micropattern can be manufactured, a metal structural body-containing polymer film that can be used in the manufacture of the patterned structural body, and a method for manufacturing the polymer film are provided. The metal structural body-containing polymer film comprises a polymer film that includes a block copolymer having an ion-conductive segment and a non-ion-conductive segment and has a microphase-separated structure including ion-conductive domains and non-ion-conductive domains, and a metal structural body localized at the ion-conductive domains.

Claims (14)

1. A method for manufacturing a patterned structural body, comprising the steps of:

preparing a metal structural body-containing polymer film by:

preparing a polymer film that includes a block copolymer having an ion-conductive segment and a non-ion-conductive segment and has a microphase-separated structure including ion-conductive domains and non-ion-conductive domains; and

forming a metal structural body localized at the ion-conductive domains;

providing the metal structural body-containing polymer film into contact with a base material and producing a composite body including the metal structural body-containing polymer film and the base material; and

etching the base material by using the metal structural body as a mask.

2. The method for manufacturing a patterned structural body according to claim 1 , further comprising a step of removing the polymer film of the metal structural body-containing polymer film between a step of producing the composite body and etching the base material by using the metal structural body as a mask.

3. The method for manufacturing a patterned structural body according to claim 1 , further comprising a step of removing the metal structural body after the step of etching the base material by using the metal structural body as a mask.

4. The method for manufacturing a patterned structural body according to claim 1 , wherein the metal structural body of the metal structural body-containing polymer film and the base material are in contact with each other.

5. The method for manufacturing a patterned structural body according to claim 1 , wherein the ion conductive segment is formed from monomers obtained by adding an ion exchange group to a diene monomer or an olefin monomer, and the non-ion conductive segment is formed from monomers comprising one or more of acrylic acid esters, methacrylic acid esters, styrene, conjugated dienes and vinyl ester compounds.

6. The method for manufacturing a patterned structural body according to claim 1 , wherein the metal structural body comprises at least one of Ni, Ag, Sn, Cu, Zn, Cr, Au, Co and Fe as a main component.

7. The method for manufacturing a patterned structural body according to claim 1 , wherein the microphase-separated structure is a periodic self-organized structure of 1 nm to 5 nm.

8. The method for manufacturing a patterned structural body according to claim 1 , wherein forming the metal structural body localized at the ion-conductive domains comprises plating the metal structural body on the ion-conductive methods by at least one of an electroplating, electroless plating and substitution plating method.

9. The method for manufacturing a patterned structural body according to claim 1 , wherein 80% or more of the metal structural body is present in the ion-conductive domains.

Priority Claims (1)
JP 2008-316040 · Dec 11, 2008 · national
Continuity (2)
Division 12632944 · Dec 8, 2009
Related Publication 20140217063A1 · Aug 7, 2014