Reduced thickness and reduced footprint semiconductor packaging
View Patent ↗Semiconductor devices and methods for forming semiconductor devices are presented. A device formed of a semiconductor material is configured to mount upon a substrate layer surface having a substrate layer wire attach pad. The device includes a top planar surface with an electrically active region, and a bottom planar surface disposed substantially parallel to the top planar surface. A shelf region is disposed between the top planar surface and the bottom planar surface, and a device wire attach pad in electrical communication with the active region is located on the shelf region.
1. A device comprising a semiconductor material configured to mount upon a substrate layer surface having a substrate layer wire attach pad, comprising:
a top planar surface further comprising an electrically active region;
a bottom planar surface disposed substantially parallel to the top planar surface, separated from the top planar surface by a device height;
a shelf region disposed between the top planar surface and the bottom planar surface, the shelf region having a shelf surface having shelf height less than the device height; and
a device wire attach pad in electrical communication with the active region;
wherein the device wire attach pad is at least partially disposed upon the shelf region, the bottom planar surface is configured to be disposed adjacent to the substrate layer, the bottom planar surface covers a portion of the substrate layer surface excluding the substrate layer wire attach pad, and the device is configured to be in electrical communication with the substrate layer via an electrical connection between the device wire attach pad and the substrate layer wire attach pad.
2. The device of claim 1 , wherein the top planar surface further comprises a perimeter at least partially surrounding the active region.
3. The device of claim 1 wherein the shelf surface is substantially parallel to the top planar surface.
4. The device of claim 3 , further comprising a shelf wall spanning between the shelf surface and the top planar surface along at least a portion of the shelf region.
5. The device of claim 3 , wherein the shelf wall is substantially perpendicular to the top planar surface and the shelf surface.
6. The device of claim 2 , wherein the shelf region is formed at least partially within the perimeter region.
7. The device of claim 6 , wherein the device wire attach pad spans between at least a portion of the top planar surface and at least a portion of the shelf region.
8. The device of claim 2 , wherein the active region spans both the top planar surface and the shelf region.
9. The device of claim 1 , wherein the top planar surface is substantially rectangular.
10. The device of claim 9 , wherein the substrate layer wire attach pad is exposed by removal of a portion of the shelf.
11. The device of claim 10 , wherein the shelf is disposed substantially in a corner of the top planar surface.
12. The device of claim 11 , wherein the shelf region is substantially rectangular prior to removal of the portion to expose the substrate layer wire attach pad.
13. The device of claim 11 , wherein the shelf region is substantially triangular prior to removal of the portion to expose the substrate layer wire attach pad.
14. The device of claim 10 , wherein the portion the shelf removed to expose the substrate layer wire attach pad comprises a via through the device.
15. The device of claim 10 , wherein the shelf region is a curved shape.
16. The device of claim 9 , wherein the shelf is disposed substantially along one edge of the first planar surface, excluding at least one corner of the first planar surface.
17. The device of claim 2 , further comprising an optically transparent over mold disposed to encapsulate the shelf and the device wire attach pad.
18. The device of claim 17 , wherein the over mold is further disposed to encapsulate at least a portion of the first planar surface.