IP Library Granted Patent US 9,124,243
Granted Patent B2
US 9,124,243 · App. 13/943,963 · Granted Sep 1, 2015

Surface acoustic wave filter device

Inventors: Daisuke Tamasaki (Nagaokakyo, JP); Kenichi Uesaka (Nagaokakyo, JP)
Assignee: Murata Manufacturing Co., Ltd.
H03H9/64H01L41/1873H03H9/02559H03H9/02834H03H9/54H03H9/6483H03H9/725H03H9/14541
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Quick Facts
Patent No.
US 9,124,243
App. No.
13/943,963
Granted
Sep 1, 2015
Kind
B2
Abstract

A surface acoustic wave filter device uses a Rayleigh wave as a main mode, and includes a ladder type surface acoustic wave filter unit. A thickness of a dielectric layer in a surface acoustic wave resonator configuring a series arm resonator is different from thickness of a dielectric layer in a surface acoustic wave resonator configuring a parallel arm resonator. A propagation orientation of a surface acoustic wave in the surface acoustic wave resonator configuring the series arm resonator is different from a propagation orientation of a surface acoustic wave in the surface acoustic wave resonator configuring the parallel arm resonator.

Claims (46)

1. A surface acoustic wave filter device comprising:

a ladder surface acoustic wave filter unit including:

a series arm;

a series arm resonator connected in the series arm;

a parallel arm arranged to connect the series arm and ground to each other; and

a parallel arm resonator provided in the parallel arm; wherein

the ladder surface acoustic wave filter unit uses a Rayleigh wave as a main mode;

each of the series arm resonator and the parallel arm resonator includes a surface acoustic wave resonator including a piezoelectric substrate, an IDT electrode located on the piezoelectric substrate, and a dielectric layer arranged so as to cover the IDT electrode;

a thickness of the dielectric layer in the surface acoustic wave resonator configuring the series arm resonator is different from a thickness of the dielectric layer in the surface acoustic wave resonator configuring the parallel arm resonator, and a propagation orientation of a surface acoustic wave in the surface acoustic wave resonator configuring the series arm resonator is different from a propagation orientation of a surface acoustic wave in the surface acoustic wave resonator configuring the parallel arm resonator;

the piezoelectric substrate is a LiNbO 3 substrate including Euler angles (φ, θ, ψ), wherein θ is within a range of about 25 degrees to about 45 degrees and ψ corresponds to a propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring the series arm resonator and a propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring the parallel arm resonator;

an angle defined by the propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring the series arm resonator with the propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring the parallel arm resonator is larger than 0 degrees and less than or equal to about 8 degrees; and

the dielectric layer in the surface acoustic wave resonator configuring the series arm resonator is thicker than the dielectric layer in the surface acoustic wave resonator configuring the parallel arm resonator, ψ of the surface acoustic wave resonator configuring the series arm resonator is within a range of 0 degrees±1 degrees, and ψ of the surface acoustic wave resonator configuring the parallel arm resonator is within a range of about 1 degrees to about 8 degrees.

2. The surface acoustic wave filter device according to claim 1 , wherein ψ of the surface acoustic wave resonator configuring the parallel arm resonator falls within a range of about 3.5 degrees to about 6.5 degrees.

3. The surface acoustic wave filter device according to claim 1 , wherein the dielectric layer includes a SiO 2 layer.

4. The surface acoustic wave filter device according to claim 1 , wherein the piezoelectric substrate in the series arm resonator and the piezoelectric substrate in the parallel arm resonator are a common piezoelectric substrate.

5. The surface acoustic wave filter device according to claim 1 , wherein the series arm resonator includes a plurality of surface acoustic wave resonators functioning as one resonator.

6. The surface acoustic wave filter device according to claim 1 , wherein the surface acoustic wave filter device is a duplexer or triplexer.

7. The surface acoustic wave filter device to claim 1 , wherein the ladder surface acoustic wave filter unit is included in at least one of a reception filter and a transmission filter.

8. The surface acoustic wave filter device according to claim 1 , wherein the series arm includes a plurality of the series arm resonators that each includes a plurality of surface acoustic wave resonators functioning as one resonator.

9. The surface acoustic wave filter device according to claim 1 , wherein the parallel arm includes a plurality of the parallel arm resonators that each includes a plurality of surface acoustic wave resonators functioning as one resonator.

10. The surface acoustic wave filter device according to claim 1 , wherein the surface acoustic wave filter device has a transmission frequency band of 1710 MHz to 1785 MHz and a reception frequency band of 1850 MHz to 1910 MHz.

11. The surface acoustic wave filter device according to claim 1 , wherein θ is about 37.5 degrees.

12. A communication device comprising:

an RF circuit; and

the surface acoustic wave filter device according to claim 1 mounted on the RF circuit.

13. The communication device according to claim 12 , wherein the communication device is a cellular telephone.

14. A surface acoustic wave filter device comprising:

a ladder surface acoustic wave filter unit including:

a series arm;

a series arm resonator connected in the series arm;

a parallel arm arranged to connect the series arm and ground to each other; and

a parallel arm resonator provided in the parallel arm; wherein

the ladder surface acoustic wave filter unit uses a Rayleigh wave as a main mode;

each of the series arm resonator and the parallel arm resonator includes a surface acoustic wave resonator including a piezoelectric substrate, an IDT electrode located on the piezoelectric substrate, and a dielectric layer arranged so as to cover the IDT electrode;

a thickness of the dielectric layer in the surface acoustic wave resonator configuring the series arm resonator is different from a thickness of the dielectric layer in the surface acoustic wave resonator configuring the parallel arm resonator, and a propagation orientation of a surface acoustic wave in the surface acoustic wave resonator configuring the series arm resonator is different from a propagation orientation of a surface acoustic wave in the surface acoustic wave resonator configuring the parallel arm resonator;

the piezoelectric substrate is a LiNbO 3 substrate including Euler angles (φ, θ, ψ), wherein θ is within a range of about 25 degrees to about 45 degrees and ψ corresponds to a propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring the series arm resonator and a propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring the parallel arm resonator;

an angle defined by the propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring the series arm resonator with the propagation orientation of the surface acoustic wave in the surface acoustic wave resonator configuring the parallel arm resonator is larger than 0 degrees and less than or equal to about 8 degrees; and

the dielectric layer in the surface acoustic wave resonator configuring the series arm resonator is thinner than the dielectric layer in the surface acoustic wave resonator configuring the parallel arm resonator, ψ of the surface acoustic wave resonator configuring the series arm resonator falls within a range of about 1 degrees to about 8 degrees, and ψ of the surface acoustic wave resonator configuring the parallel arm resonator falls within a range of 0 degrees±1 degrees.

15. The surface acoustic wave filter device according to claim 14 , wherein ψ of the surface acoustic wave resonator configuring the series arm resonator falls within a range of about 3.5 degrees to about 6.5 degrees.

16. The surface acoustic wave filter device according to claim 14 , wherein the series arm includes a plurality of the series arm resonators that each includes a plurality of surface acoustic wave resonators functioning as one resonator.

17. The surface acoustic wave filter device according to claim 4 , wherein the parallel arm includes a plurality of the parallel arm resonators that each includes a plurality of surface acoustic wave resonators functioning as one resonator.

18. The surface acoustic wave filter device according to claim 14 , wherein θ is about 37.5 degrees.

19. A communication device comprising:

an RF circuit; and

the surface acoustic wave filter device according to claim 14 mounted on the RF circuit.

20. The communication device according to claim 19 , wherein the communication device is a cellular telephone.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2013
From: TAMAZAKI, DAISUKE; UESAKA, KENICHI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 030821/0390 →
Priority Claims (1)
JP 2011-007967 · Jan 18, 2011 · national
Continuity (2)
Continuation PCTJP2011080362 · Dec 28, 2011
Related Publication 20130300519A1 · Nov 14, 2013