MEMS microphone device and method for making same
The present invention discloses a MEMS microphone device and its manufacturing method. The MEMS microphone device includes: a substrate including a first cavity; a MEMS device region above the substrate, wherein the MEMS device region includes a metal layer, a via layer, an insulating material region and a second cavity; a mask layer above the MEMS device region; a first lid having at least one opening communicating with the second cavity, the first lid being fixed above the mask layer; and a second lid fixed under the substrate.
1. A MEMS microphone device, comprising:
a substrate including a first cavity;
a MEMS device region above the substrate, wherein the MEMS device region includes at least one metal layer, at least one metal via layer, an insulating material region and a second cavity, wherein a portion of the at least one metal layer and a portion of the at least one metal via layer form a membrane and the second cavity is formed below the membrane;
a mask layer above the MEMS device region;
a first lid having at least one opening communicating with the second cavity and the first cavity, the first lid being fixed above the mask layer; and
a second lid fixed under the substrate.
2. The MEMS microphone device of claim 1 , further comprising: an adhesion layer between the first lid and the MEMS device region.
3. The MEMS microphone device of claim 1 , wherein the first lid is formed by a silicon wafer.
4. The MEMS microphone device of claim 1 , wherein the second lid is formed by a silicon wafer.
5. The MEMS microphone device of claim 1 , further comprising: at least one wire for transmitting signals from the MEMS device region to the outside of the MEMS microphone device.
6. The MEMS microphone device of claim 5 , wherein the at least one wire goes through the substrate and the second lid.
7. The MEMS microphone device of claim 1 , wherein the at least one opening communicates with the second cavity through at least one opening formed through the at least one metal layer and the at least one metal via layer.
8. The MEMS microphone device of claim 1 , wherein the second cavity communicates with the first cavity through at least one opening formed in the substrate.