Dry etching method
There is provided according to the present invention a dry etching method for a laminated film, the laminated film being formed on a substrate and having a laminated structure in which silicon layers and insulating layers are laminated together with a hole or groove defined therein in a direction perpendicular to a surface of the substrate, the dry etching method comprising etching, with an etching gas, parts of the silicon layers appearing on an inner surface of the hole or groove, characterized in that the etching gas comprises: at least one kind of gas selected from the group consisting of ClF 3 , BrF 5 , BrF 3 , IF 7 and IF 5 ; and F 2 . It is possible by such a dry etching method to prevent non-uniformity of etching depth between the silicon layers.
1. A dry etching method for a laminated film comprising etching parts of silicon layers appearing on an inner surface of a hole or groove of a laminated film with an etching gas,
wherein the etching gas comprises: at least one kind of gas selected from the group consisting of ClF 3 , BrF 5 , BrF 3 , IF 7 and IF 5 ; and F 2 ; and
wherein the laminated film is formed on a substrate and has a laminated structure wherein silicon layers and insulating layers are laminated together with a hole or groove defined therein in a direction perpendicular to a surface of the substrate.
2. The dry etching method according to claim 1 , wherein the partial pressure of ClF 3 , BrF 5 , BrF 3 , IF 7 or IF 5 in the etching gas is 1 to 200 Pa.
3. The dry etching method according to claim 2 , wherein the etching gas further comprises: at least one kind of gas selected from N 2 , He and Ar.
4. The dry etching method according to claim 2 , wherein the etching gas is brought into contact with the substrate under the condition that the temperature of the substrate is −30 to 100° C.
5. The dry etching method according to claim 1 , wherein the etching gas further comprises: at least one kind of gas selected from N 2 , He and Ar.
6. The dry etching method according to claim 5 , wherein the etching gas is brought into contact with the substrate under the condition that the temperature of the substrate is −30 to 100° C.
7. The dry etching method according to claim 1 , wherein the etching gas is brought into contact with the substrate under the condition that the temperature of the substrate is −30 to 100° C.