Package structures including discrete antennas assembled on a device
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.
1. A method of forming a package structure comprising:
forming a discrete antenna on a back side of a device, wherein the discrete antenna comprises an antenna substrate;
forming a through antenna substrate via through the antenna substrate, wherein the through antenna substrate via is vertically disposed through the antenna substrate;
coupling the through antenna substrate via with a through substrate via that is vertically disposed within the device; and
coupling the device with a package substrate.
2. The method of claim 1 further comprising forming a radiating element perpendicularly coupled with the through antenna substrate via and disposed on a top portion of the discrete antenna.
3. The method of claim 2 further comprising wherein the radiating element comprises alternating layers of conductive material and dielectric material.
4. The method of claim 1 further comprising wherein the antenna substrate comprises alternating layers of conductive material and dielectric material.
5. The method of claim 1 further comprising wherein the antenna substrate comprises at least one of a glass, undoped silicon and liquid crystal polymer.
6. The method of claim 1 further comprising wherein the through antenna substrate via is coupled to the through substrate via by one of a conductive structure and metal to metal bonding.
7. The method of claim 1 further comprising wherein the antenna substrate comprises a frequency of at least about 30 GHz.
8. The method of claim 1 further comprising wherein the through antenna substrate via coupled to the through substrate via is capable of propagating a millimeter wave signal.
9. The method of claim 1 further comprising forming a ground antenna contact on a bottom portion of the discrete antenna.
10. The method of claim 9 further comprising wherein the ground antenna contact is coupled to a grounded through substrate via that is vertically disposed in the device.
11. The method of claim 10 further comprising wherein the grounded through substrate via is adjacent to the through substrate via.
12. The method of claim 1 further comprising wherein the device comprises a system on chip that comprises a millimeter wave radio.
13. The method of claim 1 further comprising wherein an active side of the device is coupled with a package substrate by one of direct metal to metal bonding and by solder bumps.
14. The method of claim 1 further comprising wherein the package substrate comprises a multilayer package substrate.
15. The method of claim 1 further comprising wherein the package substrate comprises a BBUL package substrate, and wherein the device is partially embedded in the BBUL package substrate.
16. The method of claim 1 further comprising wherein the discrete antenna comprises physical dimensions that are less than a frequency range within which the device is capable of operating.
17. The method of claim 1 further comprising forming a plurality of discrete antennas on the device.
18. The method of claim 1 further comprising wherein a second device stacked on the device and is adjacent to the discrete antenna.
19. The method of claim 18 further comprising forming a radiation shield to surround the device and the second device.
20. The method of claim 18 further comprising wherein the second device comprises a memory device.
21. A package structure comprising:
a discrete antenna disposed on a back side of a first device, wherein the discrete antenna comprises an antenna substrate;
a through antenna substrate via, wherein the through antenna substrate via is vertically disposed through the antenna substrate;
a through substrate via that is vertically disposed within the first device and coupled with the through antenna substrate via; and
a package substrate coupled with an active side of the first device.
22. The package structure of claim 21 further comprising a radiating element perpendicularly coupled with the through antenna substrate via and disposed on a top portion of the discrete antenna.
23. The package structure of claim 21 further comprising wherein the antenna substrate comprises at least one of a glass, undoped silicon and liquid crystal polymer.
24. The package structure of claim 21 further comprising wherein the antenna substrate comprises alternating layers of conductive material and dielectric material.
25. The package structure of claim 22 further comprising wherein the radiating element comprises alternating layers of conductive material and dielectric material.
26. The package structure of claim 21 further comprising wherein the through antenna substrate via is coupled to the through substrate via by one of a conductive structure and metal to metal bonding.
27. The package structure of claim 26 further comprising wherein the through antenna substrate via coupled to the through substrate via is capable of transmitting a millimeter wave signal.
28. The package structure of claim 21 further comprising wherein the antenna substrate comprises a frequency of at least about 30 GHz.
29. The package structure of claim 21 further comprising a ground antenna contact disposed on a bottom portion of the discrete antenna.
30. The package structure of claim 29 further comprising wherein the ground antenna contact is coupled to a grounded through substrate via that is vertically disposed in the first device.
31. The package structure of claim 30 further comprising wherein the grounded through substrate via is adjacent to the through substrate via.
32. The package structure of claim 21 further comprising wherein the first device comprises a silicon on chip that comprises a millimeter wave radio.
33. The package structure of claim 21 further comprising wherein an active side of the first device is coupled with the package substrate by one of direct metal to metal bonding and solder bumps.
34. The package structure of claim 21 further comprising wherein the package substrate comprises a multilayer package substrate.
35. The package structure of claim 21 further comprising wherein the package substrate comprises a BBUL package substrate, and wherein the first device is partially embedded in the BBUL package substrate.
36. The package structure of claim 21 further comprising wherein the discrete antenna comprises physical dimensions that are less than a frequency range within which the device is capable of operating.
37. The package structure of claim 21 further comprising a plurality of discrete antennas disposed on the first device.
38. The package structure of claim 21 further comprising wherein a second device is stacked on the first device.
39. The package structure of claim 38 further comprising a radiation shield that surrounds the first device and the second device.
40. The package structure of claim 38 further comprising wherein the second device comprises a memory device.
41. A package structure comprising:
a discrete antenna disposed on a back side of a die, wherein the discrete antenna comprises an antenna substrate and the die comprises a radio;
a radiating element horizontally disposed on a top portion of the discrete antenna;
a through antenna substrate via, wherein the through antenna substrate via is vertically disposed through the antenna substrate and coupled with the radiating element;
a through substrate via that is vertically disposed within the die and coupled with the through antenna substrate via; and
a package substrate coupled with an active side of the die.
42. The package structure of claim 41 further comprising a system comprising: a bus communicatively coupled to the package structure; and an eDRAM communicatively coupled to the bus.
43. The package structure of claim 41 further comprising wherein the die comprises a system on a chip.
44. The package structure of claim 41 further comprising wherein the radio comprises a millimeter wave radio.
45. The package structure of claim 41 further comprising wherein the antenna substrate comprises a frequency of at least about 30 GHz.
46. The package structure of claim 41 further comprising wherein the through antenna substrate via coupled to the through substrate via is capable of transmitting a millimeter wave signal.