Wiring board
To obtain a wiring board that allows improving flowability of an underfill to be filled up a clearance between an electronic component and the wiring board. The present invention is a wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body, a filling member filled up between the plurality of connecting terminals, and a solder resist layer laminated on the laminated body. The filling member is in contact with at least a part of each side surface of the plurality of connecting terminals. The solder resist layer includes an opening that exposes the plurality of connecting terminals. The filling member has a surface roughness rougher than a surface roughness of a top surface of the solder resist layer.
1. A wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated, the wiring board comprising:
a plurality of connecting terminals formed separately from one another on the laminated body;
a filling member filled up between the plurality of connecting terminals, the filling member being in contact with at least a part of each side surface of the plurality of connecting terminals; and
a solder resist layer laminated on the laminated body, the solder resist layer including an opening that exposes the plurality of connecting terminals in the same opening, wherein
the filling member has a surface roughness rougher than a surface roughness of a top surface of the solder resist layer.
2. The wiring board according to claim 1 , wherein
the filling member has a surface roughness (Ra) of 0.06 μm to 0.8 μm.
3. The wiring board according to claim 1 , wherein
the solder resist layer has a surface roughness (Ra) of 0.02 μm to 0.25 μm.
4. The wiring board according to claim 1 , wherein
the solder resist layer includes the opening with an inner peripheral surface, the inner peripheral surface having a surface roughness rougher than a surface roughness of the top surface of the solder resist layer.
5. The wiring board according to claim 1 , wherein
the filling member functions as a solder resist.
6. The wiring board according to claim 1 , wherein
at least a part of the connecting terminal projects from a surface of the filling member.