IP Library Granted Patent US 9,197,219
Granted Patent B2
US 9,197,219 · App. 14/257,242 · Granted Nov 24, 2015

Electronic device, electronic apparatus, and moving object

Inventor: Manabu Kondo (Matsumoto, JP)
Assignee: SEIKO EPSON CORPORATION
H03L1/028H03H9/08H03L1/04
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Quick Facts
Patent No.
US 9,197,219
App. No.
14/257,242
Granted
Nov 24, 2015
Kind
B2
Abstract

An electronic device includes: a substrate; a resonation device; a heating element; a first support which is mounted on the substrate and supports the resonation device; and a second support which supports the substrate, in which the relationship between thermal conductivity λ 1 of the first support and thermal conductivity λ 2 of the second support satisfies an expression, λ 1>λ2.

Claims (22)

1. An electronic device comprising:

a substrate;

a resonation device;

a first support which is mounted on the substrate and supports the resonation device;

a second support which supports the substrate and which is electrically connected to the substrate; and

a heating element,

wherein the relationship between thermal conductivity λ 1 of the first support and thermal conductivity λ 2 of the second support satisfies an expression, λ 1 >λ 2 .

2. The electronic device according to claim 1 , wherein

the first support is formed of any one kind of copper, gold, silver, aluminum, and tungsten, or an alloy which includes one or more kinds of these materials, and

the second support is formed of any one kind of iron, titanium, and platinum, or an alloy which includes one or more kinds of these materials, or either Kovar or a 42 alloy.

3. The electronic device according to claim 1 , wherein

the heating element is disposed closer to the first support than the second support.

4. The electronic device according to claim 1 , wherein

the heating element is disposed at the resonation device, and

a circuit which includes an oscillation circuit is disposed on a surface on one side of the substrate.

5. The electronic device according to claim 2 , wherein

the heating element is disposed at the resonation device, and

a circuit which includes an oscillation circuit is disposed on a surface on one side of the substrate.

6. The electronic device according to claim 1 , wherein

a connection region to the substrate of the first support and a connection region to the substrate of the second support do not overlap each other when viewed in a plane.

7. An electronic apparatus comprising: the electronic device according to claim 1 .

8. A moving object comprising: the electronic device according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2014
From: KONDO, MANABU
To: SEIKO EPSON CORPORATION
Reel/Frame 032717/0545 →
Priority Claims (1)
JP 2013-092066 · Apr 25, 2013 · national
Continuity (1)
Related Publication 20140320221A1 · Oct 30, 2014