Semiconductor device and peeling off method and method of manufacturing semiconductor device
The present invention provides a peeling off method without giving damage to the peeled off layer, and aims at being capable of peeling off not only a peeled off layer having a small area but also a peeled off layer having a large area over the entire surface at excellent yield ratio. The metal layer or nitride layer 11 is provided on the substrate, and further, the oxide layer 12 being contact with the foregoing metal layer or nitride layer 11 is provided, and furthermore, if the lamination film formation or the heat processing of 500° C. or more in temperature is carried out, it can be easily and clearly separated in the layer or on the interface with the oxide layer 12 by the physical means.
1. A semiconductor device comprising:
a first substrate having flexibility;
an adhesive layer comprising resin over the first substrate;
a metal oxide layer over the adhesive layer;
an insulating layer over the metal oxide layer;
a layer containing a transistor over the insulating layer; and
an inorganic film over the layer containing the transistor.
2. The semiconductor device according to claim 1 further comprising a second substrate having flexibility over the inorganic film.
3. The semiconductor device according to claim 2 ,
wherein the first substrate is a plastic substrate, and
wherein the second substrate is a plastic substrate.
4. The semiconductor device according to claim 1 , wherein the layer further contains a light emitting element electrically connected to the transistor.
5. The semiconductor device according to claim 2 ,
wherein the insulating layer comprises a first insulating layer and a second insulating layer.
6. The semiconductor device according to claim 5 ,
wherein the first insulating layer comprises silicon oxynitride, and
wherein the second insulating layer comprises silicon oxynitride.
7. A semiconductor device comprising:
a first substrate having flexibility;
an inorganic film over the first substrate;
an adhesive layer comprising resin over the inorganic film;
a metal oxide layer over the adhesive layer;
an insulating layer over the metal oxide layer; and
a layer containing a transistor and a light emitting element electrically connected to the transistor over the insulating layer.
8. The semiconductor device according to claim 7 further comprising a second substrate having flexibility over the layer containing the transistor and the light emitting element.
9. The semiconductor device according to claim 8 ,
wherein the first substrate is a plastic substrate, and
wherein the second substrate is a plastic substrate.
10. The semiconductor device according to claim 7 ,
wherein the insulating layer comprises a first insulating layer and a second insulating layer.
11. The semiconductor device according to claim 10 ,
wherein the first insulating layer comprises silicon oxynitride, and
wherein the second insulating layer comprises silicon oxynitride.
12. The semiconductor device according to claim 1 , wherein the inorganic film consists of inorganic matters.
13. The semiconductor device according to claim 7 , wherein the inorganic film consists of inorganic matters.
14. The semiconductor device according to claim 2 , wherein a material of the second substrate having flexibility is the same as a material of the first substrate having flexibility.
15. The semiconductor device according to claim 1 , wherein the adhesive layer is configured to not be removed.
16. The semiconductor device according to claim 1 , wherein the metal oxide layer is configured to not be removed.
17. The semiconductor device according to claim 1 , wherein the semiconductor device is a semiconductor device after peeling off the layer containing the transistor, the insulating layer, and the metal oxide layer from a glass substrate.