Display module and display device
A display module 1 of the present invention includes a first board 3 , a second board 4 , a base film 5 , and a circuit member 2 . The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3 . The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4 . The circuit member 2 is formed on the base film 5.
1. A method of manufacturing a liquid crystal module comprising steps of:
preparing a first board;
forming an insulating base film on a surface of the first board;
preparing a second board having a size smaller than the first board;
bonding the first board and the second board such that an end of the first board extends outwardly from an end of the second board;
forming a circuit member on a portion of the base film corresponding to a portion of the first board that is located outside of the second board;
irradiating light to the portion of the base film corresponding to the portion of the first board that is located outside of the second board;
separating the portion of the base film irradiated with light in the irradiating step; and
removing the portion of the first board corresponding to the portion of the base film that is separated in the separating step.
2. The method according to claim 1 , further comprising bending the portion of the base film that is located outside of the second board toward an outer surface side of one of the first board and the second board, after the removing step.
3. The method according to claim 2 , wherein after the bending step, the circuit member is located on an outer surface side of the base film.
4. The method according to claim 1 , wherein
in the irradiating step, the irradiating of the light to the portion of the base film excludes irradiating the light to an end portion of the base film that is located outside of the second board, and
the method further comprising:
forming a reinforcing member that is configured with the end portion of the base film and a portion of the first board corresponding to the end portion, the reinforcing member reinforcing the portion of the base film on which the circuit member is formed in the forming step.
5. the method according to claim 4 , wherein in the forming step, the reinforcing member is formed so as to have a plan shape following a plan shape of the portion of the base film on which the circuit member is mounted.
6. The method according to claim 4 , wherein the reinforcing member is formed of a same material as the first board.