Stabilization structure including shear release posts
A stabilization structure includes a stabilization layer on a carrier substrate. The stabilization layer includes an array of staging cavities. An array of micro devices are within the array of staging cavities. Each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity. A pressure is applied to the array of micro devices from the array of transfer heads to shear the array of micro devices off the shear release posts. The sheared off micro devices are picked up from the carrier substrate using the array of transfer heads.
1. A stabilization structure comprising:
a carrier substrate;
a stabilization layer on the carrier substrate, the stabilization layer including an array of staging cavities; and
an array of micro devices within the array of staging cavities, wherein each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity.
2. The structure of claim 1 , wherein each micro device is secured above a bottom surface of the staging cavity of the stabilization layer.
3. The structure of claim 1 , wherein the stabilization layer is formed of a thermoset material.
4. The structure of claim 3 , wherein the thermoset material includes benzocyclobutene (BCB).
5. The structure of claim 1 , wherein each micro device is embedded in a sacrificial release layer.
6. The structure of claim 5 , wherein the sacrificial release layer comprises an oxide material.
7. The structure of claim 1 , wherein each micro device is a micro chip.
8. The structure of claim 1 , wherein each micro device is a micro light emitting diode (LED) device.
9. The structure of claim 1 , wherein each micro device has a maximum width of 1 μm-100 μm.
10. The structure of claim 9 , wherein each micro device is attached to a shear release post with an attachment area having a height that is less than a height of the micro device.
11. The structure of claim 10 , wherein the height of the attachment area of the micro device is up to 50% of the height of the micro device.
12. The structure of claim 5 , wherein the micro devices are thicker than the sacrificial release layer.
13. The structure of claim 1 , wherein the shear release post is formed axially between adjacent micro devices.
14. The structure of claim 1 , wherein the shear release post is formed diagonally between adjacent micro devices.