IP Library Granted Patent US 9,235,243
Granted Patent B2
US 9,235,243 · App. 13/649,356 · Granted Jan 12, 2016

Thermal profile optimization techniques

Inventor: Sip Kim Yeung (New Taipei, TW)
Assignee: Acer Incorporated
G06F1/206G06F1/3203G06F9/4893G06F11/3058G06F2201/81Y02B60/1217Y02B60/1275Y02B60/144
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Quick Facts
Patent No.
US 9,235,243
App. No.
13/649,356
Granted
Jan 12, 2016
Kind
B2
Abstract

Techniques are provided for optimizing performance of a processor. The techniques may be embodied as a method, an electronic device or a computer-readable storage media with instructions executable to perform the method. In summary, processing operations performed by a processor are identified. Each of the processing operations is evaluated to determine a resulting thermal profile associated with each of the processing operations. Based on the thermal profile associated with each of the processing operations, one or more of the processing operations are grouped in a set of processing operations to be performed together between idle times of the processor. The processing operations in the set are performed at a second speed that is higher than a first speed.

Claims (35)

1. A method for optimizing performance of a processor, comprising:

identifying processing operations performed by the processor;

evaluating each of the processing operations to determine a resulting thermal profile associated with each of the processing operations;

based on the thermal profile associated with each of the processing operations, grouping one or more of the processing operations in respective sets of processing operations to be performed together between idle times of the processor;

rearranging an order in which to execute the respective sets of processing operations to lower an overall thermal profile of the processor relative to the thermal profile of the processor when executing the processing operations without being grouped in the respective sets; and

performing the processing operations in at least one set at a second speed that is higher than a first speed so as to increase idle time between sets of processing operations.

2. The method of claim 1 , wherein grouping comprises grouping the processing operations in the respective sets such that when the processing operations in the respective sets are performed together between idle times of the processor, an overall thermal profile of the processor is lower relative to the overall thermal profile of the processor when the processing operations are not grouped in the respective sets.

3. The method of claim 1 , wherein performing comprises performing the processing operations in the at least one set at the second speed such that an aggregate thermal profile of the set of processing operations is lower relative to the aggregate thermal profile of the at least one set of processing operations when the processing operations in the at least one set are performed at the first speed.

4. The method of claim 3 , wherein increasing the processing speed comprises increasing the processing speed such that an idle duration is increased between sets of processing operations.

5. The method of claim 3 , wherein increasing the processing speed comprises changing a number of processor cores that are used to complete the processing operations.

6. The method of claim 3 , wherein increasing the processing speed comprises increasing the processing speed by increasing a clock rate associated with each of the processing operations.

7. The method of claim 1 , wherein evaluating comprises evaluating a processing time associated with each of the processing operations to determine whether or not to group the processing operations in a given set.

8. The method of claim 1 , further comprising:

storing in a database the thermal profile associated with each of the processing operations, and storing in the database an aggregate thermal profile of the processing operations in the respective sets.

9. The method of claim 8 , further comprising:

updating the database in response to a change in the thermal profile associated with any of the processing operations.

10. The method of claim 1 , wherein grouping comprises grouping the one or more processing operations to the respective sets so as to extend a life of a battery associated with the processor.

11. The method of claim 1 , wherein grouping comprises grouping the processing operations to the respective sets based on a grouping according to the Converge Platform Power Management (CPPM) protocol.

12. The method of claim 1 , wherein the second speed is a turbo processing speed.

13. An electronic device, comprising:

a processor;

a clock unit, coupled to the processor;

a memory; and

a management controller unit, coupled to the memory and the processor, and configured to:

identify processing operations performed by the processor;

evaluate each of the processing operations to determine a resulting thermal profile associated with each of the processing operations;

group based on the thermal profile associated with each of the processing one or more of the processing operations in respective sets of processing operations to be performed together between idle times of the processor;

rearrange an order in which to execute the respective sets of processing operations to lower an overall thermal profile of the processor relative to the thermal profile of the processor when executing the processing operations without being grouped in the respective sets; and

perform the processing operations in at least one set at a second speed that is higher than a first speed so as to increase idle time between sets of processing operations.

14. The electronic device of claim 13 , wherein the management controller unit is further configured to group the processing operations in the respective sets such that when the processing operations in the respective sets are performed together between idle times of the processor, an overall thermal profile of the processor is lower relative to the overall thermal profile of the processor when the processing operations are not grouped in the respective sets.

15. The electronic device of claim 13 , wherein the management controller unit is further configured to perform the processing operations in the at least one set at the second speed such that an aggregate thermal profile of the at least one set of processing operations is lower relative to the aggregate thermal profile of the at least one set of processing operations when the processing operations in the at least one set are performed at the first speed.

16. The electronic device of claim 15 , wherein the management controller unit is further configured to increase the processing speed such that an idle duration is increased between sets of processing operations.

17. The electronic device of claim 15 , wherein the management controller is further configured to change a number of processor cores that are used to complete the processing operations.

18. The electronic device of claim 15 , wherein the management controller is further configured to increase a clock rate associated with each of the processing operations.

19. The electronic device of claim 13 , wherein the management controller is further configured to evaluate a processing time associated with each of the processing operations to determine whether or not to group the processing operations in the at least one set.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2012
From: YEUNG, SIP KIM
To: ACER INCORPORATED
Reel/Frame 029111/0852 →
Priority Claims (1)
TW 101123983 A · Jul 4, 2012 · national
Continuity (1)
Related Publication 20140013098A1 · Jan 9, 2014