Dielectric material with non-halogenated curing agent

1. An article comprising:

an electrical article having an uncured polymeric dielectric composition, wherein the polymeric dielectric composition comprises about 10 to about 60 wt % epoxy resin, 20 to 90 wt % dielectric filler, and about 0.1 to about 10 wt % diaminodiphenylsulfone curing agent, and further wherein the article has, upon curing, a relative capacitance at 1 kHz that increases exponentially over the entire range from 120 to 160° C.

2. The article of claim 1 , wherein the polymeric dielectric composition comprises the dielectric filler at a loading of no more than 60% by volume, and wherein the dielectric filler comprises dielectric particles with a dielectric constant of at least 50.

3. The article of claim 2 , wherein the dielectric particles are barium titanate, barium strontium titanate, titanium oxide, lead zirconium titanate, calcium copper titanate, lead magnesium titanate, lead lanthanum zirconate titanate, silicon dioxide, or mixtures thereof.

4. The article of claim 3 , wherein the dielectric particles are barium titanate having a maximum particle size of 10 μm or less.

5. The article of claim 1 , upon curing, having a dielectric constant greater than about 10 and a loss tangent of at least about 0.0009 at 1 kHz.

6. The article of claim 1 , upon curing, having a glass transition temperature of at least 120° C. and a decomposition temperature of about 325° C. or greater.

7. The article of claim 1 having, upon curing, a dissipation factor at 1 kHz that increases exponentially over the entire range from 115 to 145° C.

8. The article of claim 1 wherein the epoxy resin is selected from the group consisting of diglycidyl ethers of polyhydric phenols, epoxy novolac resins, and combinations thereof.

9. An article comprising:

an electrical article having a conductive substrate adjacent a dielectric layer, the dielectric layer comprising a cured epoxy resin composition, wherein the cured composition comprises the reaction product of epoxy resin and a diaminodiphenylsulfone curing agent, and further wherein the article has a relative capacitance at 1 kHz that increases exponentially over the entire range from 120 to 160° C.

10. The article of claim 9 , wherein the dielectric layer further comprises dielectric particles at a loading of no more than 60% by volume.

11. The article of claim 10 , wherein the dielectric particles are barium titanate having a maximum particle size of 10 μm or less.

12. The article of claim 9 having, upon curing, a dielectric constant greater than about 10 and a loss tangent of at least about 0.0009 at 1 kHz.

13. The article of claim 9 having, upon curing, a glass transition temperature of at least 100° C. and a decomposition temperature of at least about 325° C.

14. The article of claim 9 having a dissipation factor at 1 kHz that increases exponentially over the entire range from 115 to 145° C.

15. The article of claim 9 wherein the epoxy resin is selected from the group consisting of diglycidyl ethers of polyhydric phenols, epoxy novolac resins, and combinations thereof.

16. The article of claim 9 , wherein the conductive substrate comprises copper.

17. The article of claim 9 wherein the electrical article is selected from the group consisting of capacitors, resistors, inductors, or combinations thereof.

18. The article of claim 9 wherein the electrical article is an embedded capacitor suitable for use in a printed circuit boards and integrated circuit packages.

19. The article of claim 18 wherein the embedded capacitor functions as one or more of a power supply decoupling capacitor, a low pass filter, a band pass filter, and a band stop filter.

20. The article of claim 9 , wherein the electrical article is configured to operate at frequencies greater than 500 MHz.