Method for manufacturing inserts for electronic passports
A method for manufacturing inserts provided with an electronic module supporting a chip and an antenna includes supplying top and bottom substrate sheets for a plurality of inserts, said substrates being provided with cavities for subsequently inserting an electronic module in each cavity; providing an antenna for each insert; providing at least one layer of adhesive; providing stacking and assembling by lamination a bottom substrate sheet, a first layer of adhesive, a plurality of antennas, a second layer of adhesive and a top substrate sheet; cutting the laminated assembly to obtain inserts each provided with an antenna; inserting electronic modules in the cavities after the step of laminating the substrate sheets, antennas and layers of adhesive. The method also includes printing the inner surface of at least one of the substrate sheets with a thickness-compensation layer, outside the substrate area intended for receiving the antenna.
1. A method for manufacturing inserts provided with an electronic module bearing a chip and an antenna, comprising:
providing lower and upper support sheets for plural inserts, said supports being provided with cavities for the subsequent insertion of an electronic module in each cavity;
providing an antenna for each insert;
providing at least one layer of adhesive;
providing an electronic module for each insert;
superimposing and assembling by lamination a support sheet, a first layer of adhesive, a plurality of antennas, a second layer of adhesive and another support sheet;
cutting out the laminated assembly in such a way as to obtain inserts each provided with an antenna;
inserting the electronic modules into the cavities after the step of lamination of the support sheets, the antennas and the layers of adhesive, and, on the inside face of at least one of the support sheets, a thickness-compensation layer, outside of the area of the support intended for receiving the antenna.
2. The manufacturing method as claimed in claim 1 , wherein each electronic module is prefixed in a corresponding cavity of the insert using a light pressure that is substantially at least two orders of magnitude less than the laminating pressure during the step of lamination of the support sheets.
3. The manufacturing method as claimed in claim 2 , wherein the fixing pressure of the electronic module during the insertion step is of the order of 10 to 20 kgf/cm2.
4. The manufacturing method as claimed in claim 1 , wherein the adhesive deposited between the support sheets and the antennas is an adhesive printed on the support sheets.
5. An insert for the manufacture of an electronic passport, wherein it is produced according to the manufacturing method as claimed in claim 1 .
6. A booklet, notably a booklet for a passport, wherein an insert as claimed in claim 5 is integrated between at least two of its pages.