Image device having efficient heat transfer, and associated systems
An imaging device provides efficient heat transfer by orienting components of the imaging device such that heat is transferred out of the imaging device instead of within the imaging device assembly. Heat is transferred out of the imaging device assembly through a printed circuit board to which the assembly housing is mounted thereon and/or through the housing itself.
1. An imaging device having efficient heat transfer, the imaging device comprising:
a housing forming a space therewithin;
an image sensor, located within the space and oriented in a first orientation, for generating image data from light imaged thereon by one or more lenses;
a memory device, located within the space, for storing the image data; and,
an imaging circuit, located within the space, for manipulating the image data, the imaging circuit oriented in a second orientation, the second orientation opposing the first orientation such that heat is transferred outside of the space;
wherein:
the imaging circuit contacts an imaging circuit heat sink embedded within the printed circuit board to which the housing is mounted thereon;
the imaging circuit is a flip chip imaging circuit having an imaging circuit chip and an imaging circuit heat sink coupled thereto, and
the imaging circuit heat sink contacts the printed circuit board to which the housing is mounted thereon.
2. The imaging device of claim 1 , wherein the imaging circuit heat sink contacts a printed circuit board heat sink embedded within the printed circuit board to which the housing is mounted thereon.
3. The imaging device of claim 1 , wherein:
the memory device is oriented in the second orientation,
the memory device and the imaging circuit contact a heat sink embedded within the printed circuit board to which the housing is mounted thereon.
4. The imaging device of claim 3 , wherein each of the memory device and the imaging circuit contact a separate heat sink embedded within the printed circuit board to which the housing is mounted thereon.
5. The imaging device of claim 1 , wherein:
the memory device is oriented in the second orientation,
the memory device is a flip chip memory device having a memory device chip and a memory device heat sink coupled thereto, and
the memory device heat sink and the imaging circuit heat sink contact the printed circuit board to which the housing is mounted thereon.
6. The imaging device of claim 5 , wherein the memory device heat sink and the imaging circuit heat sink contact a printed circuit board heat sink embedded within the printed circuit board to which the housing is mounted thereon.
7. The imaging device of claim 6 , the printed circuit board heat sink comprising a plurality of printed circuit board heat sinks; wherein the memory device heat sink and the imaging circuit heat sink contact a separate one of the plurality of printed circuit board heat sinks embedded within the printed circuit board to which the housing is mounted thereon.
8. The imaging device of claim 1 , wherein the space is defined completely by an inner surface of the housing.
9. An imaging in device having efficient heat transfer, the imaging device comprising:
a housing forming a space therewithin, the space defined completely by an inner surface of the housing;
an image sensor, located within the space and oriented in a first orientation, for generating image data from light imaged thereon by one or more lenses;
a memory device, located within the space, for storing the image data; and,
an imaging circuit, located within the space, for manipulating the image data, the imaging circuit oriented in a second orientation, the second orientation opposing the first orientation such that heat is transferred outside of the space;
wherein:
the memory device is oriented in the second orientation,
the memory device and the imaging circuit contact a heat sink embedded along the inner surface of the housing.
10. The imaging device of claim 9 , wherein each of the memory device and the imaging circuit contact a separate heat sink embedded along the inner surface of the housing.
11. The imaging device of claim 8 , wherein:
the memory device is oriented in the second orientation,
the memory device is a flip chip memory device having a memory device chip and a memory device heat sink coupled thereto, and
the memory device heat sink and the imaging circuit heat sink contact the inner surface of the housing.
12. The imaging device of claim 11 , wherein the memory device heat sink and the imaging circuit heat sink contact a heat sink embedded along the inner surface of the housing.
13. The imaging device of claim 12 , wherein the memory device heat sink and the imaging circuit heat sink contact separate heat sinks embedded along the inner surface of the housing.