IP Library Granted Patent US 9,260,643
Granted Patent B2
US 9,260,643 · App. 14/349,276 · Granted Feb 16, 2016

Slurry and method for producing slurry

Inventor: Koji Kitagawa (Nishigo-mura, JP)
Assignee: SHIN-ETSU HANDOTAI CO., LTD.
C09K3/1472B28D5/007B28D5/045C09K3/1409C09K3/1463H01L21/304
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Quick Facts
Patent No.
US 9,260,643
App. No.
14/349,276
Granted
Feb 16, 2016
Kind
B2
Abstract

The present invention is directed to a method for producing a slurry used in a wire saw, including: re-pulverizing with a jet mill part or all of the abrasive grains pulverized with a roller mill or a ball mill such that the abrasive grains have an average circularity of 0.900 or more; and blending the abrasive grains whose the average circularity is 0.900 or more with a coolant to produce the slurry, and to a slurry including blended abrasive grains having an average circularity of 0.900 or more. The invention enables suppression of reduction in slicing capability due to reduction in abrasive-grains concentration and of increased costs due to reduction in slicing quality and in productivity, even when abrasive grains having a grain diameter smaller than that of #2000-size abrasive grains are used to reduce a kerf loss.

Claims (12)

1. A free-abrasive slurry, comprising silicon carbide abrasive grains having a grain diameter smaller than that of #2000-size abrasive grains and an average circularity of 0.900 or more,

wherein:

the slurry is used in a wire saw,

the abrasive grains have a mass concentration of 50% or more, and

the abrasive grains are blended into the slurry.

2. The slurry according to claim 1 , wherein the abrasive grains have a diameter of 6.0 μm or less, the diameter being measured at a cumulative height of 50% by a JIS R6002 electrical resistance test method.

3. The slurry according to claim 1 , wherein a viscosity of the slurry is within a range from 100 mPa·s to 200 mPa·s.

4. The slurry according to claim 2 , wherein a viscosity of the slurry is within a range from 100 mPa·s to 200 mPa·s.

5. A method for producing a free-abrasive slurry, comprising:

pulverizing silicon carbide abrasive grains with a roller mill or a ball mill;

pulverizing part or all of the abrasive grains again with a jet mill such that the abrasive grains have a grain diameter smaller than that of #2000-size abrasive grains and an average circularity of 0.900 or more; and

blending the abrasive grains whose average circularity is 0.900 or more with a coolant to produce the free-abrasive slurry for use in a wire saw, where the abrasive grains have a mass concentration of 50% or more.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2014
From: KITAGAWA, KOJI
To: SHIN-ETSU HANDOTAI CO., LTD.
Reel/Frame 032586/0510 →
Priority Claims (1)
JP 2011-235924 · Oct 27, 2011 · national
Continuity (1)
Related Publication 20150000208A1 · Jan 1, 2015