Thin film transistor array panel and manufacturing method of the same
A thin film transistor (“TFT”) array panel includes; an insulation substrate, a TFT disposed on the insulation substrate and including a drain electrode, a passivation layer covering the TFT and including a contact portion disposed therein corresponding to the drain electrode, a partition comprising an organic material disposed on the passivation layer, and including a transverse portion, a longitudinal portion, and a contact portion disposed on the drain electrode, a color filter disposed on the passivation layer and disposed in a region defined by the partition, an organic capping layer disposed on the partition and the color filter, and a pixel electrode disposed on the organic capping layer, and connected to the drain electrode through the contact portion of the passivation layer and the contact portion of the partition, wherein a contact hole is formed in the organic capping layer corresponding to the contact portion of the passivation layer.
1. A method for manufacturing a thin film transistor array panel, comprising:
disposing a thin film transistor including a drain electrode on a substrate;
disposing a passivation layer on the thin film transistor and the substrate;
depositing a transparent organic material on the passivation layer and patterning the transparent organic material to form a partition including a transverse portion, a longitudinal portion, and a contact portion disposed on the drain electrode;
forming a color filter in a region defined by the partition through an Inkjet printing method;
depositing an organic capping layer covering the partition and the color filter;
removing a portion of the organic capping layer aligned with the drain electrode;
removing a contact portion of the partition and a portion of the passivation layer by a dry etch method to form a contact hole which exposes the drain electrode; and
electrically connecting a pixel electrode to the drain electrode through the contact hole.
2. The method of claim 1 , further comprising:
disposing a light blocking member overlapping the partition; and
disposing a spacer on the pixel electrode.
3. The method of claim 2 , wherein, the disposing of the light blocking member and the disposing of the spacer, comprises:
coating a photosensitive resist on substantially the entire surface of the organic capping layer by dispersing black pigments; and
patterning the photosensitive layer using an exposure mask including a transparent region, a translucent region, and a light blocking region through exposure and developing to form position dependent thicknesses.
4. The method of claim 1 , wherein the formation of the partition includes combining fluorine on the surface of the partition after the formation of the partition.
5. The method of claim 1 , wherein the thickness of the partition is in a range of about 2 μm to about 10 μm.
6. The method of claim 1 , wherein the partition is inclined with respect to the insulation substrate, and the inclination angle is in a range of about 50° to about 120°.
7. The method of claim 1 , wherein the transverse and longitudinal portions of the partition overlap at least a portion of a data line and a gate line connected to the thin film transistor.