Nano-grained multilayer copper alloy sheet having high strength and high electrical conductivity, and method for manufacturing same
In a high strength and high electrical conductive nano crystalline grain multi-layer copper alloy sheet, a plurality of high strength and high electrical conductive nano crystalline grain multi-layer sheets manufactured by roll-bonding an oxygen free copper (OFC) alloy sheet and a deoxidized low-phosphorous copper (DLP) alloy sheet are plastically bonded by roll-bonding method so that an OFC alloy layer and a DLP alloy layer are alternated to each other to have electrical conductivity of 85 IACS (%) or more and tensile strength of 500 MPa or more.
1. A high strength and high electrical conductive nano crystalline grain multi-layer copper alloy sheet comprising:
an oxygen free copper (OFC) alloy and a deoxidized low-phosphorous copper (DLP) alloy that are repeatedly roll-bonded to have electrical conductivity of 85 IACS (%) or more and tensile strength of 500 MPa or more.
2. The high strength and high electrical conductive nano crystalline grain multi-layer copper alloy sheet of claim 1 , wherein
an OFC alloy layer and a DLP alloy layer alternately overlap with each other.
3. The high strength and high electrical conductive nano crystalline grain multi-layer copper alloy sheet of claim 2 , wherein
the multi-layer copper alloy sheet includes two or more OFC alloy layers and DLP alloy layers.