Surface flaw modification for strengthening of glass articles
Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as Na 2 O, K 2 O and Li 2 O.
1. A method for manufacturing an electronic device comprising:
depositing thin film transistors on a first glass substrate;
joining the first glass substrate to a second glass substrate to form a glass substrate assembly, there being a gap between the first and second glass substrates;
contacting the glass substrate assembly with an aqueous acidic solution for a time from 10 seconds to less than or equal to 10 minutes, whereby glass from each of the first and second substrates is removed to a depth only from 2.5 μm to less than or equal to 20 μm when the time has elapsed;
rinsing the aqueous acidic solution from the glass substrate assembly when the time has elapsed;
injecting a liquid crystal material into the gap; and
wherein the contacting is performed after the step of joining but before the step of injecting.
2. The method according to claim 1 , wherein the contacting is conducted for a time from 10 seconds to less than or equal to 5 minutes.
3. The method according to claim 1 , wherein prior to the contacting, the glass substrate assembly is thinned by exposing the glass substrate assembly to an etchant that removes glass from at least one of the first or second glass substrates to a depth of at least about 100 μm and then washing the glass substrate assembly.
4. The method according to claim 1 , further comprising applying a polymer film to the glass substrate assembly after the step of contacting.
5. The method according to claim 4 , further comprising removing the polymer film and applying a polarizing material to the glass substrate assembly.
6. The method according to claim 1 , wherein the glass substrate assembly is a master glass substrate assembly, the method further comprising separating the master glass substrate assembly into a plurality of individual glass substrate assemblies, and wherein the step of contacting occurs after the step of separating.
7. The method according to claim 1 , wherein at least one of the first or second glass substrates comprises an alkaline earth boro-aluminosilicate glass comprising a total concentration of alkali metal oxides selected from the group consisting of Na 2 O, K 2 O and Li 2 O that does not exceed 5% by weight.
8. The method according to claim 1 , wherein the aqueous acidic solution comprises HF and HCl, and wherein a molar concentration of the HF is in a range from about 1.5M to about 4M and a molar concentration of the HC 1 is in a range from about 4.0M to about 7.0M.
9. The method according to claim 1 , wherein the aqueous acidic solution comprises HF and H 2 SO 4 .
10. The method according to claim 1 , wherein a thickness of either one or both of the first or second glass substrates is less than or equal to 500 μm before contacting the glass substrate assembly with the aqueous acidic solution.
11. The method according to claim 1 , wherein either one or both of the first or second glass substrates is substantially free of surface compression layers and central tensional stresses.
12. A method for manufacturing an electronic device comprising:
depositing thin film transistors on a first glass substrate;
joining the first glass substrate to a second glass substrate to form a glass substrate assembly, there being a gap between the first and second glass substrates;
thinning the glass substrate assembly;
after thinning, contacting the glass substrate assembly with an aqueous acidic solution for a time from 10 seconds to less than or equal to 10 minutes;
rinsing the aqueous acidic solution from the glass substrate assembly when the time has elapsed;
injecting a liquid crystal material into the gap; and
wherein the contacting is performed after the step of joining but before the step of injecting.
13. The method according to claim 12 , wherein the contacting is conducted for a time from 10 seconds to less than or equal to 5 minutes.
14. The method according to claim 12 , wherein the contacting removes glass from each of the first and second substrates to a depth from 2.5 μm to less than or equal to 20 μm before the aqueous acidic solution is rinsed from the glass substrate assembly.
15. The method according to claim 12 , wherein the thinning comprises exposing the glass substrate assembly to an etchant that removes glass from at least one of the first or second glass substrates to a depth of at least about 100 μm and then washing the glass substrate assembly.
16. The method according to claim 12 , further comprising applying a polymer film to the glass substrate assembly after the step of contacting.
17. The method according to claim 16 , further comprising removing the polymer film and applying a polarizing material to the glass substrate assembly.
18. The method according to claim 12 , wherein the glass substrate assembly is a master glass substrate assembly, the method further comprising separating the master glass substrate assembly into a plurality of individual glass substrate assemblies, and wherein the step of contacting occurs after the step of separating.
19. The method according to claim 12 , wherein at least one of the first or second glass substrates comprises an alkaline earth boro-aluminosilicate glass comprising a total concentration of alkali metal oxides selected from the group consisting of Na 2 O, K 2 O and Li 2 O that does not exceed 5% by weight.
20. The method according to claim 12 , wherein the aqueous acidic solution comprises HF and HCl, and wherein a molar concentration of the HF is in a range from about 1.5M to about 4M and a molar concentration of the HCl is in a range from about 4.0M to about 7.0M.
21. The method according to claim 12 , wherein the aqueous acidic solution comprises HF and H 2 SO 4 .
22. The method according to claim 12 , wherein a thickness of either one or both of the first or second glass substrates is less than or equal to 500 μm before contacting the glass substrate assembly with the aqueous acidic solution.