Method of manufacturing a mask frame assembly for thin film deposition
A mask frame assembly for thin film deposition including a frame having an opening portion and a support portion, and a mask having a deposition area in a position corresponding to the opening portion, wherein the mask includes a first layer including the deposition area and a peripheral portion disposed outside the deposition area and a second layer including a first surface and a second surface opposite to the first surface, at least a part of the first surface of the second layer faces the first layer and contacts the peripheral portion, and the second surface is welded to the support portion of the frame.
1. A method of manufacturing a mask frame assembly for thin film deposition, comprising:
preparing a frame such that the frame includes an opening portion and a support portion; and
preparing a mask such that the mask includes a first layer including a deposition area in a position corresponding to the opening portion and a peripheral portion disposed outside the deposition area, and a second layer including a welding portion, the welding portion including two pairs of opposing sides having a first surface and a second surface opposite to each other, wherein at least a part of one of the first surfaces of the second layer contacts the peripheral portion of the first layer and at least one of the second surfaces of the second layer is welded to the support portion of the frame, wherein the first layer includes welding patterns corresponding to welding points on the welding portion of the second layer where the second layer is welded to the support portion of the frame.
2. The method as claimed in claim 1 , wherein the mask includes at least two unit mask strips, each unit mask strip has opposite ends, and only the opposite ends of the unit mask strips are welded to the support portion of the frame.
3. The method as claimed in claim 2 , wherein preparing the mask includes:
preparing a conductive substrate;
disposing the second layer on the conductive substrate such that at least a part of an end of the conductive substrate contacts the second layer;
applying resists to the conductive substrate and the second layer;
patterning the resists;
forming the first layer on the conductive substrate, the resists, and the second layer by an electroplating method;
removing the resists; and
separating the mask including the first layer and the second layer from the conductive substrate.
4. The method as claimed in claim 3 , wherein patterning the resists includes forming first patterns on the conductive substrate and forming second patterns on the second layer.
5. The method as claimed in claim 3 , wherein:
patterning the resists includes forming first patterns on the conductive substrate and forming third patterns on a periphery of the second layer, and
at least a part of the first layer contacts the second layer.
6. The method as claimed in claim 1 , wherein preparing the mask includes preparing the first layer, preparing the second layer, and adhering the first layer to the second layer.
7. The method as claimed in claim 6 , wherein adhering the first layer to the second layer includes preparing an adhesive layer, and disposing the adhesive layer between the first layer and the second layer.
8. The method as claimed in claim 1 , wherein the first layer and the second layer include different materials.
9. The method as claimed in claim 8 , wherein the second layer includes a nickel-steel alloy.