Multi-layer heat dissipating apparatus for an electronic device

1. A multi-layer heat dissipating device comprising:

a first heat spreader layer comprising a first spreader surface and a second spreader surface;

a first support structure comprising a first support surface and a second support surface, wherein the first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader; and

a second heat spreader layer comprising a third spreader surface and a fourth spreader surface, wherein the third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure, wherein a gap is located within a region at least partially surrounded by the first heat spreader layer, the first support structure and the second heat spreader layer.

2. The multi-layer heat dissipating device of claim 1 , wherein the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity that is less than the first thermal conductivity.

3. The multi-layer heat dissipating device of claim 1 , wherein the first support structure comprises a thermally conductive adhesive layer.

4. The multi-layer heat dissipating device of claim 1 , wherein the first support structure is coupled to the first heat spreader layer through a thermally conductive adhesive layer.

5. The multi-layer heat dissipating device of claim 1 , further comprising

a second support structure comprising a third support surface and a fourth support surface, wherein the third support surface of the second support structure is coupled to the fourth spreader surface of the second heat spreader; and

a third heat spreader layer comprising a fifth spreader surface and a sixth spreader surface, wherein the fifth spreader surface of the third heat spreader layer is coupled to the fourth support surface of the second support structure.

6. The multi-layer heat dissipating device of claim 5 , wherein the first support structure has a first size, and the second support structure has a second size that is greater than the first size.

7. The multi-layer heat dissipating device of claim 5 , wherein the second heat spreader layer has a third thermal conductivity, and the second support structure has a fourth thermal conductivity that is less than the third thermal conductivity.

8. The multi-layer heat dissipating device of claim 1 , wherein the first surface of the first heat spreader layer is coupled to a heat generating region and/or a region configured to generate heat.

9. The multi-layer heat dissipating device of claim 1 , wherein the first heat spreader layer includes a first set of fins.

10. The multi-layer heat dissipating device of claim 1 , wherein the first surface of the first heat spreader layer is coupled to at least one heat generating component and/or component configured to generate heat when active.

11. The multi-layer heat dissipating device of claim 1 , wherein the first heat spreader layer is coupled to the heat generating component through a thermal interface material.

12. The multi-layer heat dissipating device of claim 1 , wherein the second surface of the second heat spreader layer is coupled to an inner portion of a first surface of an electronic device.

13. The multi-layer heat dissipating device of claim 1 , wherein the multi-layer heat dissipating device is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and/or a laptop computer.

14. An apparatus comprising:

a first heat spreading means for dissipating heat;

a first supporting means coupled to the first heat spreading means; and

a second heat spreading means for dissipating heat, wherein the second heat spreading means is coupled to the first supporting means, wherein a gap is located within a region at least partially surrounded by the first heat spreading means, the first supporting means and the second heat spreading means.

15. The apparatus of claim 14 , wherein the first heat spreading means has a first thermal conductivity, and the first supporting means has a second thermal conductivity that is less than the first thermal conductivity.

16. The apparatus of claim 14 , wherein the first supporting means is coupled to the first heat spreading means through a thermally conductive adhesive means.

17. The apparatus of claim 14 , further comprising

a second supporting means coupled to the second heat spreading means; and

a third heat spreading means for dissipating heat, wherein the third heat spreading means is coupled to the second supporting means.

18. The apparatus of claim 14 , wherein the first heat spreading means is coupled to a heat generating region and/or a region configured to generate heat.

19. The apparatus of claim 18 , wherein the heat generating region includes an integrated package.

20. The apparatus of claim 14 , wherein the second heat spreading means is coupled to an inner portion of a first surface of an electronic device.

21. The apparatus of claim 14 , wherein the apparatus is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and/or a laptop computer.

22. A device comprising:

a region configured to generate heat, the region comprising an integrated device;

a first heat spreader layer comprising a first spreader surface and a second spreader surface, wherein the first spreader surface of the first heat spreader layer is coupled to the region;

a first support structure comprising a first support surface and a second support surface, wherein the first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader; and

a second heat spreader layer comprising a third spreader surface and a fourth spreader surface, wherein the third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure, wherein a gap is located within a region at least partially surrounded by the first heat spreader layer, the first support structure and the second heat spreader layer.

23. The device of claim 22 , further comprising an electronic device surface, wherein the electronic device surface is coupled to the fourth spreader surface of the second heat spreader.

24. The device of claim 22 , further comprising

a second support structure comprising a third support surface and a fourth support surface, wherein the third support surface of the second support structure is coupled to the fourth spreader surface of the second heat spreader;

a third heat spreader layer comprising a fifth spreader surface and a sixth spreader surface, wherein the fifth spreader surface of the third heat spreader layer is coupled to the fourth support surface of the second support structure; and

an electronic device surface, wherein the electronic device surface is coupled to the sixth spreader surface of the third heat spreader.

25. The device of claim 22 , wherein the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity that is less than the first thermal conductivity.

26. The device of claim 22 , wherein the first spreader surface of the first heat spreader layer is coupled to the integrated device.

27. The device of claim 22 , wherein the region includes a printed circuit board (PCB).

28. The device of claim 22 , wherein the device is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, and/or a laptop computer.