Photosensitive resin composition and black spacer using the same

1. A photosensitive resin composition, comprising

(A) about 0.01 to about 3.0 wt % of a thermally curing initiator having a half-life of about one hour at a temperature ranging from about 100 to about 150° C.;

(B) about 0.05 to about 10.0 wt % of a photopolymerization initiator;

(C) about 1 to about 20 wt % of a binder resin comprising a cardo-based resin and acrylic-based resin, wherein the acrylic-based resin does not include a repeating unit represented by the following Chemical Formula 1 below;

(D) about 1 to about 20 wt % of a photopolymerizable compound, wherein the photopolymerizable compound includes a monofunctional ester of (meth)acrylic acid having an ethylenic unsaturated double bond, a multi-functional ester of (meth)acrylic acid having at least one ethylenic unsaturated double bond, or a combination thereof and wherein the photopolymerizable compound is not the same as the binder resin, wherein the photopolymerizable compound comprises ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy(meth)acrylate, ethylene glycol monomethylether (meth)acrylate, trimethylol propane tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, novolac epoxy (meth)acrylate, or a combination thereof;

(E) about 1 to about 40 wt % of a colorant; and

(F) a balance amount of a solvent,

wherein the amounts of (A), (B), (C), (D), (E), and (F) are each based on the total weight of the photosensitive resin composition,

wherein the thermally curing initiator having a half-life of about one hour at a temperature ranging from about 100 to about 150° C. comprises di-t-butyl peroxy hexahydroterephthalate, 2,2-bis(t-butylperoxy)butane, 1,1-bis(t-butylperoxy cyclohexane), 2,2-bis (4,4-di-t-butylperoxy cyclohexyl)propane, or a combination thereof,

wherein the cardo-based resin includes two or more repeating units represented by the following Chemical Formula 1:

wherein:

R 24 to R 27 are the same or different and are each independently hydrogen, halogen, or substituted or unsubstituted C1 to C20 alkyl,

R 28 and R 29 are the same or different and are each independently hydrogen or —CH 2 OR a , wherein R a is a vinyl group, an acrylate group or a methacrylate group,

each R 30 is the same or different and each is independently hydrogen, substituted or unsubstituted C1 to C20 alkyl, substituted or unsubstituted C2 to C20 alkenyl, an acrylate group or a methacrylate group,

each Z 1 is the same or different and each is independently a single bond, —O—, —CO—, —SO 2 —, —CR b R c —, —SiR d R e —, wherein R b to R e are the same or different and are each independently hydrogen or substituted or unsubstituted C1 to C20 alkyl, or a linking group selected from the following Chemical Formulae 2 to 12, and

each Z 2 is the same or different and is each independently an acid dianhydride residual group,

wherein in the above Chemical Formula 6, R f is hydrogen, ethyl, —C 2 H 4 Cl, —C 2 H 4 OH, —CH 2 CH═CH 2 , or phenyl,

and

wherein the acrylic-based resin is a copolymer of a first ethylenic unsaturated monomer and a second ethylenic unsaturated monomer that is copolymerizable with the first ethylenic unsaturated monomer and includes at least one acrylic-based repeating unit,

wherein the term substituted refers to one substituted with a substituent including halogen, a hydroxyl group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azido group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, C1 to C20 alkyl, C2 to C20 alkenyl, C2 to C20 alkynyl, C6 to C30 aryl, C3 to C20 cycloalkyl, C3 to C20 cycloalkenyl, C3 to C20 cycloalkynyl, C2 to C20 heterocycloalkyl, C2 to C20 heterocycloalkenyl, C2 to C20 heterocycloalkynyl, C3 to C30 heteroaryl, or a combination thereof, instead of at least one hydrogen.

2. The photosensitive resin composition of claim 1 , wherein the thermally curing initiator (A) has a half-life of about one hour at a temperature ranging from about 100 to about 120° C.

3. The photosensitive resin composition of claim 1 , comprising the thermally curing initiator (A) in an amount of about 0.1 to about 10.0 wt % based on the total weight of the photosensitive resin composition excluding the solvent.

4. The photosensitive resin composition of claim 1 , wherein the colorant comprises an organic pigment, an inorganic pigment, or a combination thereof,

the organic pigment comprises a black organic pigment, and

the inorganic pigment comprises carbon black, chromium oxide, iron oxide, titan black, titanium carbide, aniline black, or a combination thereof.

5. A black spacer of a display device manufactured using the photosensitive resin composition of claim 1 , wherein the black spacer comprises a light-blocking layer combined with a column spacer.

6. The photosensitive resin composition of claim 1 , wherein the thermally curing initiator having a half-life of about one hour at a temperature ranging from about 100 to about 150° C. comprises di-t-butyl peroxy hexahydroterephthalate.

7. The photosensitive resin composition of claim 1 , wherein the thermally curing initiator having a half-life of about one hour at a temperature ranging from about 100 to about 150° C. comprises 2,2-bis(t-butylperoxy)butane.

8. The photosensitive resin composition of claim 1 , wherein the thermally curing initiator having a half-life of about one hour at a temperature ranging from about 100 to about 150° C. comprises 1,1-bis(t-butylperoxy cyclohexane).

9. The photosensitive resin composition of claim 1 , wherein the thermally curing initiator having a half-life of about one hour at a temperature ranging from about 100 to about 150° C. comprises 2,2-bis (4,4-di-t-butylperoxy cyclohexyl)propane.