Semiconductor device and method of manufacturing the same
A semiconductor device includes a first electrode, a second electrode, a first semiconductor layer of a first conductivity type located between the first electrode and the second electrode and having a region in which a carbon vacancy density becomes lower in a first direction from the first electrode to the second electrode, a second semiconductor layer of the first conductivity type located between the first electrode and the first semiconductor layer and having an impurity element concentration higher than the impurity element concentration of the first semiconductor layer, and a plurality of third semiconductor layers of a second conductivity type located between the second electrode and the first semiconductor layer.
1. A semiconductor device comprising:
a first electrode;
a second electrode;
a first semiconductor layer of a first conductivity type located between the first electrode and the second electrode and having a region in which a carbon vacancy density becomes lower in a first direction from the first electrode to the second electrode;
a second semiconductor layer of the first conductivity type located between the first electrode and the first semiconductor layer and having an impurity element concentration higher than the impurity element concentration of the first semiconductor layer; and
a plurality of third semiconductor layers of a second conductivity type that are located between the second electrode and the first semiconductor layer.
2. The device according to claim 1 ,
wherein the first semiconductor layer extends between adjacent third semiconductor layers, and
an insulating layer is located between the first semiconductor layer located between the adjacent third semiconductor layers and the second electrode.
3. The device according to claim 2 ,
wherein the plurality of third semiconductor layers extend in a direction crossing the first direction.
4. The device according to claim 2 , wherein the insulating layer further extends over a portion of the third semiconductor layers.
5. The device according to claim 1 ,
wherein the plurality of third semiconductor layers extend in a direction crossing the first direction.
6. The device according to claim 1 , wherein the first semiconductor layer comprises silicon carbide.
7. The device according to claim 6 , wherein the second semiconductor layer comprises silicon carbide.
8. The device according to claim 1 , wherein the first semiconductor layer is doped with aluminum ions.
9. A PIN diode, comprising:
a first electrode;
a second electrode;
a first semiconductor layer of a first conductivity type located between the first electrode and the second electrode and having a region in which a carbon vacancy density becomes lower in the direction from the first electrode to the second electrode;
a second semiconductor layer of the first conductivity type located between the first electrode and the first semiconductor layer and having an impurity element concentration higher than the impurity element concentration of the first semiconductor layer; and
a plurality of third semiconductor layers of a second conductivity type that are located between the second electrode and the first semiconductor layer, wherein the third semiconductor layers are separated by a portion of the first semiconductor layer extending between adjacent third semiconductor layers.
10. The PIN diode of claim 9 , further comprising an insulating layer disposed between the portion of the first semiconductor layer extending between adjacent third semiconductor layers and the first electrode.
11. The PIN diode of claim 10 , wherein the insulating layer comprises an oxidized first semiconductor layer material.
12. The PIN diode of claim 10 , wherein the insulating layer extends over a portion of the third semiconductor layer adjacent to the portion of the first semiconductor layer extending between adjacent third semiconductor layers and the first electrode.
13. The PIN diode of claim 9 , wherein the first semiconductor layer includes aluminum.
14. The PIN diode of claim 9 , wherein the first semiconductor layer comprises aluminum doped silicon carbide.
15. The PIN diode of claim 9 , wherein the second semiconductor layer comprises aluminum doped silicon carbide.