Multi-chip module with multiple interposers
A Multi-Chip Module is presented herein that comprises a package substrate, at least two integrated circuit devices, each of which is electrically coupled to the package substrate, and an interposer. Formed in the interposer are electrical connections which are predominantly horizontal interconnects. The first interposer is arranged to electrically couple the two integrated circuit devices to each other. Methods for manufacturing a Multi-Chip Module are also presented herein.
1. An apparatus comprising:
a package substrate;
at least two integrated circuit devices, each of which is electrically coupled to the package substrate;
a first interposer comprising predominantly horizontal interconnects formed therein, the first interposer being arranged between the at least two integrated circuit device to electrically couple the at least two integrated circuit devices to each other,
a second interposer; and
a third interposer,
wherein for a first of the at least two integrated circuit devices, an area of overlap between the first of the at least two integrated circuit devices and the first interposer is less than an area of the first of the at least two integrated circuit devices, and
wherein the first of the at least two integrated circuit devices overlaps with the first interposer and the second interposer and does not overlap with the third interposer, and
wherein the second of the at least two integrated circuit devices overlaps with the first interposer and the third interposer and does not overlap with the second interposer.
2. The apparatus of claim 1 , wherein the second interposer has vertical through vias formed therein, wherein the first of the at least two integrated circuit devices is electrically coupled to the package substrate by the vertical through vias in the second interposer.
3. The apparatus of claim 1 , wherein the first of the at least two integrated circuit devices comprises an application specific integrated circuit, and the second of the at least two integrated circuit devices comprises a memory device.
4. The apparatus of claim 3 , wherein the memory device comprises a memory stack.
5. The apparatus of claim 1 , further comprising microbumps that electrically couple the at least two integrated circuit devices to the horizontal interconnects.
6. The apparatus of claim 5 , further comprising underfill encapsulation of the microbumps.
7. The apparatus of claim 1 , further comprising adhesive or solder bumps that electrically couple the first interposer to the package substrate.
8. The apparatus of claim 7 , further comprising underfill encapsulation of the adhesive or solder bumps.
9. An apparatus comprising.
a package substrate;
at least two integrated circuit devices, each of which is electrically coupled to the package substrate; and
a plurality of interposers arranged to electrically couple the two integrated circuit devices to each other and to the package substrate, a first interposer of the plurality of interposers having predominantly vertical through vias and second and third interposers of the plurality of interposers having predominantly horizontal interconnects,
wherein for a first of the at least two integrated circuit devices, an area of overlap between the first of the at least two integrated circuit devices and the first of the plurality of interposers is less than an area of the first of the at least two integrated circuit devices,
wherein for a second of the at least two integrated circuit devices, an area of overlap between the second of the at least two integrated circuit devices and the first of the plurality of interposers is less than an area of the second of the second of the at least two integrated circuit devices;
wherein the first of the at least two integrated circuit devices overlaps with the first interposer and the second interposer, and does not overlap with the third interposer, and
wherein the second of the at least two integrated circuit devices overlaps with the first interposer and the third interposer, and does not overlap with the second interposer, and
wherein the first of the plurality of interposers is arranged between the at least two integrated circuit devices to electrically couple the at least two integrated circuit devices to each other.
10. The apparatus of claim 9 , wherein for each of the at least two integrated circuit devices and each of the plurality of interposers, an area of overlap between each of the integrated circuit devices and each of the interposers is less than an area of each of the integrated circuit devices.
11. The apparatus of claim 9 , wherein the first of the at least two integrated circuit devices comprises an application specific integrated circuit, and the second of the at least two integrated circuit devices comprises a memory stack.
12. The apparatus of claim 9 , further comprising microbumps that electrically couple the at least two integrated circuit devices to the horizontal interconnects.
13. The apparatus of claim 1 , wherein an area of the first interposer is less than an area of the first of the at least two integrated circuit devices and less than an area of a second of the at least two integrated circuit devices.
14. The apparatus of claim 1 , wherein the first interposer further comprises vertical through vias.
15. The apparatus of claim 1 , wherein the first interposer contains only horizontal interconnects.
16. The apparatus of claim 1 , further comprising a heat spreader.
17. A Multi-Chip Module comprising the apparatus of claim 1 .
18. The apparatus of claim 9 , wherein an area of the first of the plurality of interposers is less than an area of the first of the at least two integrated circuit devices and less than an area of the second of the at least two integrated circuit devices.
19. The apparatus of claim 9 , wherein the first of the plurality of interposers having predominantly horizontal interconnects further comprises vertical through vias.
20. The apparatus of claim 9 , wherein the first of the plurality of interposers having predominantly horizontal interconnects contains only horizontal interconnects.
21. The apparatus of claim 9 , further comprising a heat spreader.
22. The apparatus of claim 1 , wherein the first interposer, the second interposer and the third interposer comprise a modular system of interposers forming all of the electrical interconnections between the at least two integrated circuit devices and all of the electrical connections between the at least two integrated circuit devices and the package substrate.
23. The apparatus of claim 22 , wherein an area of at least one of the at least two integrated circuit devices is greater than an area of a largest of the modular system of interposers.
24. The apparatus of claim 9 , wherein the plurality of interposers comprise a modular system of interposers forming all of the electrical interconnections between the at least two integrated circuit devices and all of the electrical connections between the at least two integrated circuit devices and the package substrate.