Gateless switch with capacitively-coupled contacts
A switch includes an input contact and an output contact to a conducting channel. At least one of the input and output contacts is capacitively coupled to the conducting channel. A control contact is located outside of a region between the input and output contacts, and can be used to adjust the switch between on and off operating states. The switch can be implemented as a radio frequency switch in a circuit.
1. A switch comprising:
a semiconductor structure including a conducting channel;
an input contact to the conducting channel located on a surface of the semiconductor structure;
an output contact to the conducting channel located on the surface of the semiconductor structure, wherein the input contact and the output contact form opposing sides of an input-output region, wherein the input-output region is further defined by the conducting channel and a surface of the semiconductor structure between the input and output contacts, and wherein at least one of the input contact or the output contact is capacitively coupled to the conducting channel; and
at least one control contact located outside of the input-output region, wherein the at least one control contact is not located between the input and output contacts.
2. The switch of claim 1 , wherein the at least one control contact is located on the surface of the semiconductor structure and is capacitively coupled to the conducting channel.
3. The switch of claim 1 , wherein the at least one control contact is an ohmic contact to the conducting channel.
4. The switch of claim 1 , wherein the at least one control contact includes a first control contact located adjacent to the input contact and a second control contact located adjacent to the output contact.
5. The switch of claim 1 , wherein the at least one control contact is located on an opposing side of the conducting channel from the input contact and the output contact.
6. The switch of claim 5 , wherein the at least one control contact comprises a conducting substrate.
7. The switch of claim 1 , the semiconductor structure further comprising:
a barrier layer comprising a wide band gap, wherein the input contact and the output contact are located over the barrier layer; and
a buffer layer comprising a band gap narrower than the barrier layer, wherein the conducting channel is formed at an interface of the barrier layer and the buffer layer.
8. The switch of claim 7 , the semiconductor structure further comprising an insulating layer located over the barrier layer, wherein the input contact and the output contact are located over the insulating layer.
9. The switch of claim 1 , the semiconductor structure further comprising an insulating layer located in the input-output region, wherein the insulating layer contacts the input contact and the output contact.
10. The switch of claim 9 , the semiconductor structure further comprising a second insulating layer located between the input contact and one of the at least one control contact and a third insulating layer located between the output contact and another one of the at least one control contact.
11. The switch of claim 1 , the semiconductor structure further comprising a second conducting channel, wherein the input contact, the output contact and the at least one control contact are coupled to the second conducting channel, and wherein at least one of the input contact or the output contact is capacitively coupled to the second conducting channel.
12. The switch of claim 1 , wherein the conducting channel is doped with impurities.
13. A circuit comprising:
a radio frequency (RF) switch including:
a semiconductor structure including a conducting channel;
an input contact to the conducting channel located on a surface of the semiconductor structure;
an output contact to the conducting channel located on the surface of the semiconductor structure, wherein the input contact and the output contact form opposing sides of an input-output region, wherein the input-output region is further defined by the conducting channel and a surface of the semiconductor structure between the input and output contacts, and wherein at least one of the input contact or the output contact is capacitively coupled to the conducting channel; and
at least one control contact located outside of the input-output region, wherein the at least one control contact is not located between the input and output contacts;
a RF source electrically connected to the input contact;
a RF output electrically connected to the output contact; and
a RF control circuit electrically connected to the at least one control contact.
14. The circuit of claim 13 , wherein the RF control circuit is configured to turn the RF switch off by generating a reverse voltage bias at the input and output contacts with respect to the conducting channel using the at least one control contact.
15. The circuit of claim 13 , wherein the RF control circuit is configured to turn the RF switch on by generating one of: a zero voltage or a forward voltage bias at the input and output contacts with respect to the conducting channel using the at least one control contact.
16. The circuit of claim 13 , wherein the input contact is monolithically integrated with the RF input and the output contact is monolithically integrated with the RF output.
17. The circuit of claim 13 , wherein the semiconductor structure further includes an insulating layer located in the input-output region, wherein the insulating layer contacts the input contact and the output contact.
18. A switch comprising:
a semiconductor structure including:
a barrier layer comprising a wide band gap; and
a buffer layer comprising a band gap narrower than the barrier layer, wherein a conducting channel is formed at an interface of the barrier layer and the buffer layer;
an input contact to the conducting channel located over the barrier layer on a surface of the semiconductor structure;
an output contact to the conducting channel located over the barrier layer on the surface of the semiconductor structure, wherein the input contact and the output contact form opposing sides of an input-output region, wherein the input-output region is further defined by the conducting channel and a surface of the semiconductor structure between the input and output contacts, and wherein the input contact and the output contact are capacitively coupled to the conducting channel; and
at least one control contact located over the barrier layer outside of the input-output region, wherein the at least one control contact is not located between the input and output contacts.
19. The switch of claim 18 , the semiconductor structure further comprising an insulating layer located over the barrier layer, wherein the input contact and the output contact are located over the insulating layer.
20. The switch of claim 18 , the semiconductor structure further comprising an insulating layer located in the input-output region, wherein the insulating layer contacts the input contact and the output contact.