Semiconductor device with improved electrode isolation
A floating gate insulating film is formed in a first element formation region of a substrate. A first insulating film and a control gate electrode are continuously formed from the first element formation region to a first element isolation film. A selection gate insulating film and a selection gate electrode are formed in the substrate located in the first element formation region. The selection gate electrode is continuously formed over the first element isolation film. A side surface of the selection gate electrode is in contact with a first side surface of a floating gate electrode through a second insulating film. An upper surface of a region overlapping with the selection gate electrode in the first element isolation film is located lower than an upper surface of the substrate.
1. A semiconductor device comprising:
a substrate;
a first element isolation film which is formed in the substrate and is located adjacent to a first element formation region of the substrate;
a floating gate insulating film formed over the substrate located in the first element formation region;
a floating gate electrode formed over the floating gate insulating film;
a control gate electrode formed over the floating gate electrode via a first insulating film;
a selection gate insulating film which is formed over the substrate located in the first element formation region and is located adjacent to the floating gate insulating film;
a selection gate electrode which is continuously formed over the selection gate insulating film and the first element isolation film and whose side surface is in contact with a first side surface of the floating gate electrode through a second insulating film; and
an erase gate electrode that is in contact with a second side surface of the floating gate electrode through a third insulating film,
wherein a first upper surface, which is an upper surface of a region overlapping with the selection gate electrode in the first element isolation film, is located lower than an upper surface of the substrate.
2. The semiconductor device according to claim 1 ,
wherein a lower end of the second insulating film is located lower than the upper surface of the substrate.
3. The semiconductor device according to claim 2 ,
wherein a distance from the lower end of the second insulating film to a bottom surface of the floating gate electrode is greater than a thickness of the second insulating film.
4. The semiconductor device according to claim 1 ,
wherein the first upper surface is located lower than a second upper surface which is an upper surface of a region overlapping with the control gate electrode in the first element isolation film.
5. The semiconductor device according to claim 4 , further comprising:
a second element isolation film which is formed in the substrate and is located adjacent to a second element formation region; and
a transistor formed in the second element formation region,
wherein a part of a gate electrode of the transistor is located over the second element isolation film, and
wherein an upper surface of a region overlapping with the gate electrode in the second element isolation film is higher than the first upper surface and lower than the second upper surface.
6. The semiconductor device according to claim 1 , further comprising:
a second element isolation film which is formed in the substrate and is located adjacent to a second element formation region; and
a transistor formed in the second element formation region,
wherein an upper surface of the second element isolation film is located higher than the first upper surface.