Gallium-nitride-on-diamond wafers and manufacturing equipment and methods of manufacture
A method for integrating wide-gap semiconductors, and specifically, gallium nitride epilayers, with synthetic diamond substrates is disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or formed on a layered structure that comprises at least one layer of gallium nitride. Methods for manufacturing GaN-on-diamond wafers with low bow and high crystalline quality are disclosed along with preferred choices for manufacturing GaN-on-diamond wafers and chips tailored to specific applications.
1. A substrate prepared for synthetic diamond deposition comprising:
(a) a silicon wafer of thickness greater than 0.2 mm;
(b) a layer of glass;
(c) a layer of polysilicon;
(d) a first silicon nitride layer;
(e) a multilayered structure layer including at least one layer of gallium nitride; and
(f) a second silicon nitride layer with thickness not greater than 100 nm,
wherein the layer of glass bonds the silicon wafer to the layer of polysilicon, the first silicon nitride layer is disposed on the layer of polysilicon, the multilayer structure including at least one layer of gallium nitride is disposed on the first silicon nitride layer, and the second silicon nitride layer is disposed on the multilayer structure including at least one layer of gallium nitride, the second nitride layer having an exposed surface prepared for synthetic diamond deposition.
2. The substrate of claim 1 , wherein said gallium nitride layer features Ga-facing surface parallel and proximal to said first silicon nitride.
3. The substrate of claim 1 , wherein a surface of said gallium nitride layer is a non-polar or semi-polar surface of gallium nitride.
4. The substrate of claim 1 , wherein said glass has a melting temperature above 1000° C.
5. The substrate of claim 1 , wherein said second silicon nitride layer is an in-situ silicon nitride.