IP Library Granted Patent US 9,360,241
Granted Patent B2
US 9,360,241 · App. 13/807,710 · Granted Jun 7, 2016

Heat pump system

Inventors: Hiroshi Nakayama (Sakai, JP); Shuji Fujimoto (Sakai, JP)
Assignee: Daikin Industries, Ltd.
F25B30/02F24D3/18F24D17/02F25B1/10F24D19/1054F24D19/1087F25B40/00F25B2339/047F25B2400/072F25B2400/13
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Quick Facts
Patent No.
US 9,360,241
App. No.
13/807,710
Granted
Jun 7, 2016
Kind
B2
Abstract

A heat pump system includes a heat pump circuit, a load distribution element, and a controller. The heat pump circuit includes low-stage and high-stage compression mechanisms having a fixed capacity ratio relationship. The load distribution element establishes a load distribution between first and second heat loads subjected to heating processes by heat exchange with refrigerant discharged from the low-stage and high-stage compression mechanisms, respectively. The controller performs distribution control to maintain a ratio of 1 between temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively. Alternatively, the controller performs distribution control to reduce a difference between the temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively.

Claims (29)

1. A heat pump system comprising:

a heat pump circuit including a compression mechanism with a low-stage compression mechanism and a high-stage compression mechanism having a fixed capacity ratio relationship, an expansion mechanism, and an evaporator, with a refrigerant being circulated through the heat pump circuit;

a load distribution element configured and arranged to establish a load distribution between

a first heat load subjected to a heating process by heat exchange with a refrigerant discharged from the low-stage compression mechanism, and

a second heat load subjected to a heating process by heat exchange with a refrigerant discharged from the high-stage compression mechanism; and

a controller configured to perform a distribution control of the load distribution element

so as to maintain a ratio of 1 between

a temperature of the refrigerant discharged from the low-stage compression mechanism and after heat exchange with the first heat load, and

a temperature of the refrigerant discharged from the high-stage compression mechanism and after heat exchange with the second heat load; or

so as to reduce a difference between

the temperature of the refrigerant discharged from the low-stage compression mechanism and after heat exchange with the first heat load, and

the temperature of the refrigerant discharged from the high-stage compression mechanism and after heat exchange with the second heat load.

2. The heat pump system according to claim 1 , wherein

the load distribution element includes

a heat load circuit having a branching portion, a converging portion, a first passage connecting the branching portion and the converging portion, and a second passage connecting the branching portion and the converging portion without converging with the first passage, a fluid flowing through the heat load circuit, and

a flow rate regulation mechanism configured and arranged to regulate a ratio between a flow rate of the fluid flowing through the first passage and a flow rate of the fluid flowing through the second passage; and

the heat pump system further comprises:

a first heat exchanger arranged and configured to perform heat exchange between the refrigerant flowing from the discharge side of the low-stage compression mechanism toward the intake side of the high-stage compression mechanism and the fluid flowing through the first passage; and

a second heat exchanger arranged and configured to perform heat exchange between the refrigerant flowing from the high-stage compression mechanism to the expansion mechanism and the fluid flowing through the second passage,

in the distribution control performed by the controller, the flow rate regulation mechanism is operated

so as to maintain a ratio of 1 between a temperature of the refrigerant flowing through an outlet of the first heat exchanger in the heat pump circuit and a temperature of the refrigerant flowing through an outlet of the second heat exchanger in the heat pump circuit; or

so as to reduce a difference between the temperature of the refrigerant flowing through the outlet of the first heat exchanger in the heat pump circuit and the temperature of the refrigerant flowing through the outlet of the second heat exchanger in the heat pump circuit.

3. The heat pump system according to claim 2 , wherein

when a temperature of refrigerant flowing into the second heat exchanger is higher than a temperature of the refrigerant flowing into the first heat exchanger and when a flow rate of the fluid flowing to the first heat exchanger is less than a first predetermined flow rate due to the flow rate regulation control being performed, the controller

performs high-stage discharge temperature control of the flow rate regulation mechanism so that a flow rate of the fluid flowing to the first heat exchanger is maintained at a flow rate of at least the first predetermined flow rate, and

controls the heat pump circuit so as to raise a target temperature of the discharged refrigerant of the high-stage compression mechanism.

4. The heat pump system according to claim 3 , wherein

the controller performs the high-stage discharge temperature control in a range such that the target temperature of the discharged refrigerant of the high-stage compression mechanism does not exceed a predetermined upper limit temperature, and

if the upper limit temperature is exceeded, the controller controls the flow rate regulation mechanism so that the fluid does not flow to the first heat exchanger but the fluid does flow to the second heat exchanger.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2012
From: NAKAYAMA, HIROSHI; FUJIMOTO, SHUJI
To: DAIKIN INDUSTRIES, LTD.
Reel/Frame 029544/0186 →
Priority Claims (1)
JP 2010-160745 · Jul 15, 2010 · national
Continuity (1)
Related Publication 20130098102A1 · Apr 25, 2013