Gyro MEMS sensor package
An integrated circuit packaging structure comprises at least one Micro Electrical Mechanical Systems (MEMS) gyroscope die mounted directly on a multi-layer flexible substrate having at least one metal layer and wire-bonded to the flexible substrate and a lid or die coating protecting the MEMS die and wire bonds.
1. An integrated circuit packaging structure comprising:
at least one Micro Electrical Mechanical Systems (MEMS) die mounted directly on a multi-layer flexible substrate or on a stiffener and wherein said flexible substrate is folded or wrapped around an underside of said stiffener and wire-bonded to said flexible substrate wherein said flexible substrate has at least one metal layer and wherein said flexible substrate remains underlying said MEMS die; and
a lid or die coating protecting sides and top surfaces of said MEMS die and wire bonds.
2. The structure according to claim 1 wherein said at least one MEMS die comprises a gyroscope.
3. The structure according to claim 1 wherein said at least one MEMS die is mounted on said flexible substrate by conductive or non-conductive epoxy paste or film.
4. The structure according to claim 1 wherein said stiffener comprises one of the group containing: copper, aluminum, stainless steel, ceramic, zinc, or tungsten, or any other metal.
5. The structure according to claim 1 wherein said MEMS die is wire-bonded to gold fingers on said flexible substrate.
6. The structure according to claim 1 wherein said die coating encapsulates said MEMS die and wire bonds.
7. The structure according to claim 1 wherein said lid comprises metal or liquid crystal polymer and wherein said lid is attached to said flexible substrate by conductive or non-conductive epoxy.
8. The structure according to claim 1 wherein said flexible substrate is attached to a multi-layer flexible substrate on a side opposite to said MEMS die wherein said multi-layer flexible substrate comprises one or more conductive metal layers and one or more dielectric layers wherein said attaching is by solder or conductive adhesive or a combination of solder and conductive adhesive.
9. The structure according to claim 1 wherein said flexible substrate is a multi-layer flexible substrate comprising one or more conductive metal layers and one or more dielectric layers.
10. A method of assembling an integrated circuit packaging structure comprising:
mounting at least one Micro Electrical Mechanical Systems (MEMS) die directly on a multi-layer flexible substrate having at least one metal layer or on a stiffener and wherein said flexible substrate is folded or wrapped around an underside of said stiffener wherein said flexible substrate remains underlying said MEMS die;
making electrical connections between said MEMS die and said flexible substrate; and
protecting top and side surfaces of said MEMS die and electrical connections with a lid or die coating.
11. The method according to claim 10 wherein said at least one MEMS die comprises a gyroscope.
12. The method according to claim 10 wherein said at least one MEMS die is mounted on said flexible substrate by conductive or non-conductive epoxy paste or film.
13. The method according to claim 10 wherein said stiffener comprises one of the group containing: copper, aluminum, stainless steel, ceramic, zinc, or tungsten, or any other metal.
14. The method according to claim 10 wherein said making electrical connections comprises wire-bonding said MEMS die to gold fingers on said flexible substrate and wherein wire bonds comprise Cu, Au, Pd, or Al.
15. The method according to claim 10 wherein said die coating encapsulates said MEMS die and wire bonds.
16. The method according to claim 10 wherein said lid comprises metal or liquid crystal polymer and wherein said lid is attached to said flexible substrate by conductive or non-conductive epoxy.
17. The method according to claim 10 further comprising:
attaching said flexible substrate to a multi-layer flexible substrate on a side opposite to said MEMS die wherein said multi-layer flexible substrate comprises one or more conductive metal layers and one or more dielectric layers wherein said attaching comprises solder or conductive adhesive or a combination of solder and conductive adhesive.
18. An integrated circuit packaging structure comprising:
at least one Micro Electrical Mechanical Systems (MEMS) gyroscope die mounted directly on a multi-layer flexible substrate and wire-bonded to said flexible substrate or on a stiffener and wherein said flexible substrate is folded or wrapped around an underside of said stiffener wherein said flexible substrate has at least one metal layer and wherein said flexible substrate remains underlying said MEMS die; and
a lid or die coating protecting top and side surfaces of said MEMS die and wire bonds.