Nitride semiconductor wafer, nitride semiconductor element, and method for manufacturing nitride semiconductor wafer
A nitride semiconductor wafer includes a silicon substrate, a first layer, a second layer, a third layer, a fourth layer, a fifth layer, and a sixth layer. The first layer is provided on the silicon substrate. The second layer is provided on the first layer. The third layer is provided on the second layer. The fourth layer is provided on the third layer. The fifth layer is provided on the fourth layer. The sixth layer is provided on the fifth layer. A composition ratio x4 of the fourth layer decreases in a first direction from the third layer toward the fifth layer. A maximum value of the composition ratio x4 is not more than a composition ratio of the third layer. A minimum value of the composition ratio x4 is not less than a composition ratio of the fifth layer.
1. A method for manufacturing a nitride semiconductor wafer, comprising:
forming a first layer of Al x1 Ga 1-x1 N (0.8≦x1≦1) on a silicon substrate;
forming a second layer of Al x2 Ga 1-x2 N (0.7≦x2<0.8) on the first layer;
forming a third layer of Al x3 Ga 1-x3 N (0.4≦x3≦0.6) on the second layer;
forming a fourth layer of Al x4 Ga 1-x4 N on the third layer;
forming a fifth layer of Al x5 Ga 1-x5 N (0.1≦x5≦0.2) on the fourth layer; and
forming a sixth layer of Al 6 Ga 1-x6 N (0≦x6<x5) on the fifth layer,
the forming of the fourth layer including causing the composition ratio x4 of the fourth layer to decrease in a first direction from the third layer toward the fifth layer, setting a maximum value of the composition ratio x4 to be not more than the composition ratio x3 of the third layer, and setting a minimum value of the composition ratio x4 to be not less than the composition ratio x5 of the fifth layer.
2. The method according to claim 1 , wherein a growth temperature of the Al x1 Ga 1-x1 N is not less than 1000° C. and not more than 1300° C.
3. The method according to claim 1 , wherein a length of the first layer in the first direction is not less than 150 nm and not more than 250 nm.
4. The method according to claim 1 , wherein a length of the second layer in the first direction is not less than 80 nm and not more than 200 nm.
5. The method according to claim 1 , wherein a length of the third layer in the first direction is not less than 80 nm and not more than 200 nm.
6. The method according to claim 1 , wherein a length of the fourth layer in the first direction is not less than 500 nm and not more than 700 nm.
7. The method according to claim 1 , wherein a length of the fifth layer in the first direction is not less than 100 nm and not more than 250 nm.
8. The method according to claim 1 , wherein the sum of a length of the second layer in the first direction, a length of the third layer in the first direction, a length of the fourth layer in the first direction, and a length of the fifth layer in the first direction is not less than 800 nm and not more than 1200 nm.
9. The method according to claim 1 , wherein
the second layer contacts the first layer,
the third layer contacts the second layer,
the fourth layer contacts the third layer,
the fifth layer contacts the fourth layer, and
the sixth layer contacts the fifth layer.
10. The method according to claim 1 , further comprising forming a first silicon-containing unit including silicon provided between the fifth layer and the sixth layer.
11. The method according to claim 10 , wherein
the second layer contacts the first layer,
the third layer contacts the second layer,
the fourth layer contacts the third layer,
the fifth layer contacts the fourth layer,
the first silicon-containing unit contacts the fifth layer, and
the sixth layer contacts the first silicon-containing unit.
12. The method according to claim 10 , further comprising:
forming a seventh layer including Al x7 Ga 1-x7 N (0≦x7<x5) provided between the first silicon-containing unit and the sixth layer; and
forming a second silicon-containing unit including silicon provided between the sixth layer and the seventh layer.
13. The method according to claim 12 , wherein
the second layer contacts the first layer,
the third layer contacts the second layer,
the fourth layer contacts the third layer,
the fifth layer contacts the fourth layer,
the first silicon-containing unit contacts the fifth layer,
the seventh layer contacts the first silicon-containing unit,
the second silicon-containing unit contacts the seventh layer, and
the sixth layer contacts the second silicon-containing unit.
14. The method according to claim 1 , wherein
the maximum value of the composition ratio x4 is the same as the composition ratio x3 of the third layer, and
the minimum value of the composition ratio x4 is the same as the composition ratio x5 of the fifth layer.