IP Library Granted Patent US 9,365,933
Granted Patent B2
US 9,365,933 · App. 14/718,127 · Granted Jun 14, 2016

Method of forming a fine pattern

Inventors: Jung-Ha Son (Seoul, KR); Su-Bin Bae (Gyeongsan-si, KR); Yu-Gwang Jeong (Anyang-si, KR); Lei Xie (Suwon-si, KR); Yun-Jong Yeo (Seoul, KR); Joo-Hyung Lee (Seongnam-si, KR)
Assignee: Samsung Display Co., Ltd.
C23F1/02G03F7/0002H01L21/0337
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Quick Facts
Patent No.
US 9,365,933
App. No.
14/718,127
Granted
Jun 14, 2016
Kind
B2
Abstract

A method of forming a fine pattern includes providing a first metal layer on a base substrate, providing a first passivation layer on the first metal layer, providing a mask pattern on the first passivation layer, providing a partitioning wall pattern having a reverse taper shape by etching the first passivation layer, coating a composition having a block copolymer between the partitioning wall patterns adjacent each other, providing a self-aligned pattern by heating the composition, and providing a metal pattern by etching the first metal layer using the self-aligned pattern as a mask.

Claims (43)

1. A method of forming a fine pattern, the method comprising:

forming a first metal layer on a substrate;

forming a first passivation layer on the first metal layer;

forming a mask pattern on the first passivation layer;

etching the first passivation layer to form a partitioning wall pattern having a reverse taper shape;

coating the first metal layer in an area between the partitioning wall patterns adjacent each other with a composition comprising a block copolymer;

heating the composition, the heating transforming the composition into a self-aligned pattern; and

etching the first metal layer using the self-aligned pattern as a mask to form a metal pattern.

2. The method of claim 1 , wherein the first metal layer comprises aluminum or an alloy of aluminum.

3. The method of claim 1 , wherein the partitioning wall pattern forms a reverse tapered angle with the first metal layer greater than or equal to 45° and less than or equal to 90°.

4. The method of claim 1 , wherein the block copolymer is at least one selected from the group consisting of a block copolymer of styrene and methymethacrlate (PS-b-PMMA), a block copolymer of styrene and 4-(tetra-butyldimethylsilyl)oxystyrene (PS-b-PSSi), a block copolymer of styrene and dimethylsiloxane (PS-b-PDMS) and a block copolymer of styrene and vinylpyrrolidone (PS-b-PVP).

5. The method of claim 1 , wherein weight-average molecular weight of the block copolymer is 3,000 to 1,000,000.

6. The method of claim 1 , wherein the composition comprising the block copolymer further comprises a solvent.

7. The method of claim 6 , wherein the composition comprises about 0.5 wt % to 20 wt % block copolymer.

8. The method of claim 6 , wherein the solvent is at least one selected from the group consisting of toluene, xylene, propylene glycol mono-methyl ether aceate (PGMEA), propylene glycol mono-methyl ether (PGME), cyclohexanone, and ethylactate.

9. The method of claim 1 , wherein the composition is heated over glass to a transition temperature.

10. The method of claim 9 , wherein the composition is heated to between 200° C. and 300° C.

11. The method of claim 1 , wherein the self-aligned pattern comprises:

first nano patterns; and

second nano patterns disposed between the first nano patterns.

12. The method of claim 1 , wherein the first nano patterns and the second nano patterns each have a different etching selectivity.

13. The method of claim 1 , further comprising etching a portion of the self-aligned pattern by oxygen plasma treatment.

14. A method of forming a fine pattern, the method comprising:

forming a first metal layer on a substrate;

forming a first passivation layer on the first metal layer;

forming a second metal layer on the first passivation layer;

forming a second passivation layer on the second metal layer;

forming a mask pattern on the second passivation layer;

etching the second passivation layer to form a passivation pattern;

providing a preliminary partitioning wall pattern at a side of the passivation pattern;

etching the second metal layer and the first passivation layer using the preliminary partitioning wall pattern as a mask to form a partitioning wall pattern having a reverse taper shape;

coating the first metal layer in an area between the partitioning wall patterns adjacent each other with a composition comprising a block copolymer;

providing a self-aligned pattern by heating the composition;

etching a portion of the self-aligned pattern;

providing a metal pattern by etching the first metal layer using the self-aligned pattern as a mask.

15. The method of claim 14 , wherein the first metal layer comprises aluminum or an alloy of aluminum.

16. The method of claim 14 , wherein the partitioning wall pattern forms a reverse tapered angle with the first metal layer greater than or equal to 45° and less than or equal to 90°.

17. The method of claim 14 , wherein the block copolymer is at least one selected from the group consisting of a block copolymer of styrene and methymethacrlate (PS-b-PMMA), a block copolymer of styrene and 4-(tetra-butyldimethylsilyl)oxystyrene (PS-b-PSSi), a block copolymer of styrene and dimethylsiloxane (PS-b-PDMS) and a block copolymer of styrene and vinylpyrrolidone (PS-b-PVP).

18. The method of claim 14 , wherein the composition is heated to between 200° C. and 300° C.

19. The method of claim 14 , wherein the self-aligned pattern comprises:

first nano patterns; and

second nano patterns disposed between the first nano patterns.

20. The method of claim 19 , wherein the first nano patterns and the second nano patterns each have a different etching selectivity.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2015
From: SON, JUNG-HA; BAE, SU-BIN; JEONG, YU-GWANG; XIE, LEI; YEO, YUN-JONG; LEE, JOO-HYUNG
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 035688/0901 →
Priority Claims (1)
KR 10-2014-0161671 · Nov 19, 2014 · national
Continuity (1)
Related Publication 20160138169A1 · May 19, 2016