IP Library Granted Patent US 9,371,338
Granted Patent B2
US 9,371,338 · App. 14/372,105 · Granted Jun 21, 2016

Organosilane precursors for ALD/CVD silicon-containing film applications

Inventors: Christian Dussarrat (Tokyo, JP); Glenn Kuchenbeiser (Newark, DE); Venkateswara R. Pallem (Hockessin, DE)
Assignee: American Air Liquide, Inc.
C07F7/025B05D1/60C23C16/30C23C16/345C23C16/36C23C16/401C23C16/402C23C16/44H01L21/0228H01L21/02216H01L21/02271H01L21/02532
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Quick Facts
Patent No.
US 9,371,338
App. No.
14/372,105
Granted
Jun 21, 2016
Kind
B2
Abstract

Disclosed are Si-containing thin film forming precursors, methods of synthesizing the same, and methods of using the same to deposit silicon-containing films using vapor deposition processes for manufacturing semiconductors, photovoltaics, LCD-TFT, flat panel-type devices, refractory materials, or aeronautics.

Claims (30)

1. A Si-containing thin film forming precursor having the following formula:

wherein R 1 and R 2 may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle group and R 3 may be H, a C1 to C6 alkyl group, a C3-C20 aryl or heterocycle group, an amino group, an alkoxy group, or a halogen.

2. The Si-containing thin film forming precursor of claim 1 , having the following formula:

wherein R 1 and R 2 may each independently be a C1 to C6 alkyl group.

3. The Si-containing thin film forming precursor of claim 2 , wherein the molecule is SiH 3 (N i Pr-amd).

4. The Si-containing thin film forming precursor of claim 1 , having the following formula:

wherein R 1 , R 2 , R 3 and R 4 may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle.

5. The Si-containing thin film forming precursor of claim 1 , having the following formula:

wherein R 1 , R 2 , and R 3 may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle.

6. The Si-containing thin film forming precursor of claim 1 , having the following formula:

wherein R 1 and R 2 may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle and X may be CI, Br, I, or F.

7. A method of depositing a Si-containing layer on a substrate, the method comprising:

Introducing at least one organosilane precursor of claim 1 into a reactor having at least one substrate disposed therein;

depositing at least part of the organosilane precursor onto the at least one substrate to form a Si-containing layer using a vapor deposition method.

8. The method of claim 7 , further comprising introducing into the reactor at least one co-reactant.

9. The method of claim 8 , wherein the co-reactant is selected from the group consisting of P 2 , O 3 , H 2 O, H 2 O 2 , NO, NO 2 , a carboxylic acid, radicals thereof, and combinations thereof, preferably plasma treated oxygen or ozone.

10. The method of claim 8 , wherein the co-reactant is selected from the group consisting of H 2 , NH 3 , (SiH 3 ) 3 N, hydridosilanes (such as SiH 4 , Si 2 H 6 , Si 3 H 8 , Si 4 H 10 , Si 5 H 10 , Si 6 H 12 ), chlorosilanes and chloropolysilanes (such as SiHCl 3 , SiH 2 Cl 2 , SiH 3 Cl, Si 2 Cl 6 , Si 2 HCl 5 , Si 3 Cl 8 ), alkysilanes (such as Me 2 SiH 2 , Et 2 SiH 2 , MeSiH 3 , EtSiH 3 ), hydrazines (such as N 2 H 4 , MeHNNH 2 , MeHNNHMe), organic amines (such as NMeH 2 , NEtH 2 , NMe 2 H, NEt 2 H, NMe 3 , NEt 3 , (SiMe 3 ) 2 NH), pyrazoline, pyridine, B-containing molecules (such as B 2 H 6 , 9-borabicylo[3,3,1]none, trimethylboron, triethylboron, borazine), alkyl metals (such as trimethylaluminum, triethylaluminum, dimethylzinc, diethylzinc), radical species thereof, and mixtures thereof.

11. The method of claim 10 , wherein the co-reactant is selected from the group consisting of H 2 , NH 3 , SiH 4 , Si 2 H 6 , Si 3 H 8 , SiH 2 Me 2 , SiH 2 Et 2 , N(SiH 3 ) 3 , hydrogen radicals thereof, and mixtures thereof.

12. The method of claim 10 , wherein the co-reactant is selected from the group consisting of SiHCl 3 , Si 2 Cl 6 , Si 2 HCl 5 , Si 2 H 2 Cl 4 , and cyclo-Si 6 H 6 Cl 6 .

13. The method of claim 7 , wherein the vapor deposition process is a chemical vapor deposition process.

14. The method of claim 7 , wherein the vapor deposition process is an atomic layer deposition process.

15. The method of claim 7 , wherein the organosilane precursor has the following formula:

wherein R 1 and R 2 may each independently be a C1 to C6 alkyl group.

16. The method of claim 15 , wherein the organosilane precursor is SiH 3 (N i Pr-amd).

17. The method of claim 7 , wherein the organosilane precursor has the following formula:

wherein R 1 , R 2 , R 3 and R 4 may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle.

18. The method of claim 7 , wherein the organosilane precursor has the following formula:

wherein R 1 , R 2 , and R 3 may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle.

19. The method of claim 7 , wherein the organosilane precursor has the following formula:

wherein R 1 and R 2 may each independently be H, a C1 to C6 alkyl group, or a C3-C20 aryl or heterocycle and X may be CI, Br, I, or F.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2014
From: DUSSARRAT, CHRISTIAN; KUCHENBEISER, GLENN; PALLEM, VENKATESWARA R.
To: AMERICAN AIR LIQUIDE, INC.
Reel/Frame 033329/0939 →
Continuity (2)
Provisional Application 61674103 · Jul 20, 2012
Related Publication 20150004317A1 · Jan 1, 2015