IP Library Granted Patent US 9,374,085
Granted Patent B2
US 9,374,085 · App. 14/934,062 · Granted Jun 21, 2016

Bidirectional two-base bipolar junction transistor operation, circuits, and systems with double base short at initial turn-off

Inventors: William C. Alexander (Spicewood, TX); Richard A. Blanchard (Los Altos, CA)
Assignee: Ideal Power Inc.
H03K17/66H01L29/0619H01L29/0804H01L29/0817H01L29/0821H01L29/1004H01L29/16H01L29/1604H01L29/41708H01L29/42304H01L29/73H01L29/732H01L29/7375H01L29/7393H01L29/7395H02M1/088H02M3/158H02M3/1582H02M7/797H02M11/00H03K3/012H03K17/60H03K17/687
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Quick Facts
Patent No.
US 9,374,085
App. No.
14/934,062
Granted
Jun 21, 2016
Kind
B2
Abstract

Methods, systems, circuits, and devices for power-packet-switching power converters using bidirectional bipolar transistors (BTRANs) for switching. Four-terminal three-layer BTRANs provide substantially identical operation in either direction with forward voltages of less than a diode drop. BTRANs are fully symmetric merged double-base bidirectional bipolar opposite-faced devices which operate under conditions of high non-equilibrium carrier concentration, and which can have surprising synergies when used as bidirectional switches for power-packet-switching power converters. BTRANs are driven into a state of high carrier concentration, making the on-state voltage drop very low.

Claims (8)

1. A method for switching a power bipolar semiconductor device which includes both first-conductivity-type emitter/collector regions and also second-conductivity-type base contact regions on both opposed surfaces of a semiconductor die, and which has an ON state and an OFF state, comprising the actions of:

beginning turn-off by temporarily connecting the base contact and emitter/collector regions on the first surface together, while separately connecting the base contact and emitter/collector regions on the second surface together, without connecting the base contact region on the first surface to the base contact region on the second surface, except through the semiconductor die itself; and then

floating one, but not both, of the base contact regions.

2. The method of claim 1 , wherein the semiconductor die is silicon.

3. The method of claim 1 , further comprising, during the ON state, applying base current to one of the base contact regions.

4. The method of claim 3 , wherein said step of applying base current supplies base current to the base contact region.

5. The method of claim 3 , wherein the step of applying base current draws current from the base contact region.

6. The method of claim 3 , further comprising, in the ON state, conducting current as a diode, before the step of applying base current.

Continuity (18)
Continuation 14755065 · Jun 30, 2015
Continuation 14735782 · Jun 10, 2015
Continuation 14514988 · Oct 15, 2014
Continuation 14313960 · Jun 24, 2014
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