IP Library Granted Patent US 9,393,787
Granted Patent B2
US 9,393,787 · App. 14/852,060 · Granted Jul 19, 2016

Method and apparatus for discharging liquid material

Inventor: Kazumasa Ikushima (Tokyo, JP)
Assignee: MUSASHI ENGINEERING, INC.
B41J2/1433B05B12/06B05C5/02B05C11/1034B41J2/0458B41J2/04516B41J2/04556B41J2/04581B41J2202/05
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Quick Facts
Patent No.
US 9,393,787
App. No.
14/852,060
Granted
Jul 19, 2016
Kind
B2
Abstract

[Object] To provide a method and apparatus for discharging a liquid material, which can solve the problems regarding the occurrence of a satellite and accuracy of a landing position. [Solving Means] In a method for discharging a liquid material in the state of a liquid droplet through a discharge orifice by applying inertial force to the liquid material, the method is characterized in comprising the steps of measuring a distance A from a lower end of the discharge orifice to a lower end of the liquid material having flowed out from the discharge orifice at the time when the liquid material having flowed out from the discharge orifice separates from the discharge orifice, and setting a distance B between the lower end of the discharge orifice and a work surface to be approximately the same as the distance A. An apparatus for carrying out the method is also provided.

Claims (24)

1. A method for discharging a liquid material by a discharging apparatus capable of moving a work and a discharge orifice relative to each other and discharging the liquid material in the state of a liquid droplet through the discharge orifice, the method comprising:

a first step of setting a distance between the lower end of the discharge orifice and a work surface to such a distance as enabling a distance between a lower end of the liquid droplet and the work surface to be approximately zero, at the time when the liquid droplet separates from the discharge orifice; and

a second step of forming a dot of the liquid material, whose amount is substantially equal to that of the liquid material at the time when the liquid material discharged separates from the discharge orifice as a single droplet, on the work by discharging the liquid material.

2. The method for discharging the liquid material according to claim 1 , wherein the distance between the lower end of the discharge orifice and the work surface in the first step is such a distance as enabling the liquid material having flowed out from the discharge orifice to be cut after landing on the work and enabling the liquid material to separate from the discharge orifice without moving the discharge orifice.

3. The method for discharging the liquid material according to claim 1 , further comprising, prior to the first step, a step of obtaining a distance from the lower end of the discharge orifice to a lower end of a droplet of the liquid material discharged from the discharge orifice at the time when the liquid material discharged separates from the discharge orifice as a single droplet.

4. The method for discharging the liquid material according to claim 1 , wherein the discharging apparatus comprises a liquid chamber communicating with the discharge orifice, and a plunger which advances and retracts within the liquid chamber, and discharges the liquid material from the discharge orifice, by a single advancing movement of the plunger.

5. The method for discharging the liquid material according to claim 1 , wherein the discharging apparatus comprises a distance obtaining device for obtaining the distance between the work and the discharge orifice.

6. The method for discharging the liquid material according to claim 1 , wherein the liquid material is discharged while the work and the discharge orifice are horizontally moved relative to each other.

7. A method for discharging the liquid material, the method comprising a step of filling a liquid material between a chip and a substrate for semiconductors by the method for discharging the liquid material according to claim 1 .

8. A method for discharging the liquid material, the method comprising a step of applying a sealant to an upper surface of a chip for semiconductors by the method for discharging the liquid material according to claim 1 .

9. An apparatus for discharging a liquid material in the state of a liquid droplet through the discharge orifice, comprising:

a discharge section including a discharge orifice,

a work holding mechanism for holding a work at a position opposed to the discharge orifice,

a discharge distance adjusting mechanism capable of adjusting a distance between a lower end of the discharge orifice and a work surface, and

a control section,

wherein the control section is configured to perform the steps of: (a) setting a distance B between the lower end of the discharge orifice and a work surface to such a distance as enabling a distance between a lower end of the liquid droplet and the work surface to be approximately zero, at the time when the liquid droplet separates from the discharge orifice, and (b) controlling the discharge distance adjusting mechanism such that the distance between the lower end of the discharge orifice and the work surface is held the distance B when the liquid material is discharged from the discharged orifice, thereby forming a dot of the liquid material, whose amount is substantially equal to that of the liquid material at the time when the liquid material discharged separates from the discharge orifice as a single droplet, on the work.

10. The apparatus for discharging the liquid material according to claim 9 , wherein the distance B in the step of (a) is such a distance as enabling the liquid material having flowed out from the discharge orifice to be cut after landing on the work and enabling the liquid material to separate from the discharge orifice without moving the discharge orifice.

11. The apparatus for discharging the liquid material according to claim 9 , further comprising a distance obtaining device for obtaining a distance from the lower end of the discharge orifice to a lower end of a droplet of the liquid material,

wherein the control section, prior to the step of (a), performs the step of obtaining the distance from the lower end of the discharge orifice to the lower end of the droplet of the liquid material discharged from the discharge orifice, by the distance obtaining device, at the time when the liquid material discharged separates from the discharge orifice as a single droplet.

12. The apparatus for discharging the liquid material according to claim 9 , further comprising a liquid chamber communicating with the discharge orifice and the plunger which advances and retracts within the liquid chamber,

wherein the apparatus discharges the liquid material from the discharge orifice, by a single advancing movement of the plunger.

13. The apparatus for discharging the liquid material according to claim 9 , further comprising a distance obtaining device for obtaining a distance between the lower end of the discharge orifice and the work surface.

14. The apparatus for discharging the liquid material according to claim 9 , further comprising a horizontally relatively moving mechanism for horizontally moving the work and the discharge orifice relative to each other,

wherein the control section holds the distance between the work and the discharge orifice constant.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2015
From: IKUSHIMA, KAZUMASA
To: MUSASHI ENGINEERING, INC.
Reel/Frame 036554/0876 →
Priority Claims (1)
JP 2007-132440 · May 18, 2007 · national
Continuity (2)
Continuation 12600823
Related Publication 20150375507A1 · Dec 31, 2015