IP Library › Granted Patent US 9,394,466
Granted Patent B2
US 9,394,466 · App. 12/988,415 · Granted Jul 19, 2016

Method of making adhesive article

Inventors: Audrey A. Sherman (St. Paul, MN); Jayshree Seth (Woodbury, MN); Wendi J. Winkler (Minnespolis, MN)
Assignee: 3M Innovative Properties Company
C09J7/0207C09J2201/28Y10T156/10Y10T428/24612
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Quick Facts
Patent No.
US 9,394,466
App. No.
12/988,415
Granted
Jul 19, 2016
Kind
B2
Abstract

Methods of making cut adhesive articles are described. The methods involve: providing a crosslinked pressure sensitive adhesive layer disposed on a substrate, embossing a surface of the crosslinked pressure sensitive adhesive layer to form a microstructured crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and die cutting the microstructured crosslinked pressure sensitive adhesive layer.

Claims (44)

1. A method of dispensing an adhesive article, comprising:

providing a microstructured adhesive article prepared by:

providing a chemically crosslinked pressure sensitive adhesive layer disposed on a substrate where the chemically crosslinked pressure sensitive adhesive is a crosslinked poly(meth)acrylate pressure sensitive adhesive, and

embossing a surface of the chemically crosslinked pressure sensitive adhesive layer to form a microstructured chemically crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, wherein embossing comprises contacting a surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner, wherein the microstructured release liner comprises a polyethylene-coated paper liner with a solvent delivered silicone release coating, and wherein the microstructured release liner comprises a microstructured pattern having features with depths of from 13-25 micrometers; and

bending the microstructured adhesive article such that the microstructured chemically crosslinked pressure sensitive adhesive layer self-releases from the microstructured liner.

2. A method of making a cut adhesive article, comprising:

providing an adhesive article having a chemically crosslinked pressure sensitive adhesive layer disposed on a substrate where the chemically crosslinked pressure sensitive adhesive is a crosslinked poly(meth)acrylate pressure sensitive adhesive,

embossing a surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner, wherein the microstructured release liner comprises a silicone-coated polyethylene terephthalate liner or a high density polyethylene-coated paper liner with a solventless silicone release coating, and wherein the liner comprises a microstructured pattern having features with depths of from 13-25 micrometers to form a microstructured chemically crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and

die cutting the microstructured chemically crosslinked pressure sensitive adhesive layer, wherein the die cut edge of the microstructured chemically crosslinked pressure sensitive adhesive layer shows decreased adhesive ooze and edge stickiness when compared to the same chemically crosslinked pressure sensitive adhesive layer that does not have a microstructured surface.

3. The method of claim 1 , wherein embossing comprises contacting the surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner.

4. The method of claim 3 , wherein die cutting further comprises die cutting the microstructured release liner.

5. The method of claim 1 , wherein embossing comprises contacting the surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured molding tool.

6. The method of claim 1 , wherein die cutting comprises rotary die cutting.

7. The method of claim 1 , wherein die cutting further comprises die cutting the substrate.

8. A method of forming a laminate, comprising:

providing an adhesive article having a chemically crosslinked pressure sensitive adhesive layer disposed on a substrate where the chemically crosslinked pressure sensitive adhesive is a crosslinked poly(meth)acrylate pressure sensitive adhesive,

embossing a surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner, wherein the microstructured release liner comprises a silicone-coated polyethylene terephthalate liner or a high density polyethylene-coated paper liner with a solventless silicone release coating and wherein the liner comprises a microstructured pattern having features with depths of from 13-25 micrometers, to form a microstructured chemically crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and

die cutting the microstructured chemically crosslinked pressure sensitive adhesive layer, wherein the die cut edge of the microstructured chemically crosslinked pressure sensitive adhesive layer shows decreased adhesive ooze and edge stickiness when compared to the same chemically crosslinked pressure sensitive adhesive layer that does not have a microstructured surface,

exposing the microstructured adhesive surface by removing the microstructured release liner, and

contacting the microstructured adhesive surface to a second substrate.

9. A method of forming a laminate, comprising:

providing an adhesive article having a chemically crosslinked pressure sensitive adhesive layer disposed on a substrate where the chemically crosslinked pressure sensitive adhesive is a crosslinked poly(meth)acrylate pressure sensitive adhesive,

embossing a surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner, wherein the microstructured release liner comprises a silicone-coated polyethylene terephthalate liner or a high density polyethylene-coated paper liner with a solventless silicone release coating, and wherein the liner comprises a microstructured pattern having features with depths of from 13-25 micrometers, to form a microstructured chemically crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and

die cutting the microstructured chemically crosslinked pressure sensitive adhesive layer, wherein the die cut edge of the microstructured chemically crosslinked pressure sensitive adhesive layer shows decreased adhesive ooze and edge stickiness when compared to the same chemically crosslinked pressure sensitive adhesive layer that does not have a microstructured surface,

exposing the microstructured adhesive surface by removing the microstructured release liner, the substrate comprising a release liner;

contacting the microstructured adhesive surface with a second substrate;

removing the release liner to expose a surface of the cut adhesive article; and

contacting the surface to a third substrate.

10. A method of forming a cut adhesive article, comprising:

providing an adhesive article comprising a chemically crosslinked pressure sensitive adhesive layer disposed between two release liners where the chemically crosslinked pressure sensitive adhesive is a crosslinked poly(meth)acrylate pressure sensitive adhesive;

removing one of the two release liners to expose a surface of the chemically crosslinked pressure sensitive adhesive layer;

embossing the surface of the chemically crosslinked pressure sensitive adhesive layer to form a microstructured chemically crosslinked pressure sensitive adhesive layer having a microstructured surface, wherein embossing comprises contacting the surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner, wherein the microstructured liner comprises a silicone-coated polyethylene terephthalate liner or a high density polyethylene-coated paper liner with a solventless silicone release coating, and wherein the microstructured release liner comprises a microstructured pattern having features with depths of from 13-25 micrometers; and

die cutting the microstructured chemically crosslinked pressure sensitive adhesive layer, wherein the die cut edge of the microstructured chemically crosslinked pressure sensitive adhesive layer shows decreased adhesive ooze and edge stickiness when compared to the same chemically crosslinked pressure sensitive adhesive layer that does not have a microstructured surface.

11. A method of forming a cut adhesive article, comprising:

providing an adhesive article comprising a chemically crosslinked pressure sensitive adhesive layer disposed on a release liner substrate where the chemically crosslinked pressure sensitive adhesive is a crosslinked poly(meth)acrylate pressure sensitive adhesive;

contacting the chemically crosslinked pressure sensitive adhesive layer with a substrate;

removing the release liner to expose a surface of the chemically crosslinked pressure sensitive adhesive layer;

embossing the surface of the chemically crosslinked pressure sensitive adhesive layer to form a microstructured chemically crosslinked pressure sensitive adhesive layer having a microstructured surface, wherein embossing comprises contacting the surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner, wherein the microstructured release liner comprises a silicone-coated polyethylene terephthalate liner or a high density polyethylene-coated paper liner with a solventless silicone release coating, and wherein the microstructured release liner comprises a microstructured pattern having features with depths of from 13-25 micrometers; and

die cutting the microstructured chemically crosslinked pressure sensitive adhesive layer, wherein the die cut edge of the microstructured chemically crosslinked pressure sensitive adhesive layer shows decreased adhesive ooze and edge stickiness when compared to the same chemically crosslinked pressure sensitive adhesive layer that does not have a microstructured surface.

12. A method of making a roll of cut adhesive articles, comprising:

providing an adhesive article having a chemically crosslinked pressure sensitive adhesive layer disposed on a substrate where the chemically crosslinked pressure sensitive adhesive is a crosslinked poly(meth)acrylate pressure sensitive adhesive;

embossing a surface of the chemically crosslinked pressure sensitive adhesive layer to form a microstructured chemically crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, wherein embossing comprises contacting the surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner, wherein the microstructured release liner comprises a silicone-coated polyethylene terephthalate liner or a high density polyethylene-coated paper liner with a solventless silicone release coating, and where the microstructured release liner comprises a microstructured pattern having features with depths of from 13-25 micrometers;

die cutting the microstructured chemically crosslinked pressure sensitive adhesive layer to form a plurality of cut adhesive articles, wherein the die cut edge of the microstructured chemically crosslinked pressure sensitive adhesive layer shows decreased adhesive ooze and edge stickiness when compared to the same chemically crosslinked pressure sensitive adhesive layer that does not have a microstructured surface; and

forming the plurality of cut adhesive articles into a roll.

Continuity (2)
Provisional Application 61046813 · Apr 22, 2008
Related Publication 20110064916A1 · Mar 17, 2011