Method and apparatus for mitigating effects of parasitic capacitance in semiconductor devices

1. A semiconductor device comprising:

a gate layer comprising (i) a first section and (ii) a second section, wherein the gate layer is non-linear such that the first section of the gate layer is offset with respect to the second section of the gate layer, and wherein the first section of the gate layer and the second section of the gate layer form a continuous section of the gate layer; and

a first contact, a second contact, a third contact, and a fourth contact,

wherein the first section of the gate layer is at (i) a first distance from the first contact and (ii) a second distance from the second contact, wherein the first distance is different from the second distance,

wherein the second section of the gate layer is substantially at a third distance from each of the third contact and the fourth contact,

wherein at least a part of the first section of the gate layer is included in a first transistor,

wherein at least a part of the second section of the gate layer is included in a second transistor, and

wherein the second transistor is different from and adjacent to the first transistor.

2. The semiconductor device of claim 1 , wherein the second section of the gate layer is substantially at a same distance from each of the first contact and the second contact.

3. The semiconductor device of claim 1 , wherein:

the gate layer further comprises a third section; and

the first section of the gate layer is offset with respect to the third section of the gate layer.

4. The semiconductor device of claim 3 , wherein:

the second section of the gate layer is linear with respect to the third section of the gate layer.

5. The semiconductor device of claim 1 , wherein:

the first contact is a drain contact of a transistor; and

the second contact is a source contact of the transistor.

6. The semiconductor device of claim 5 , wherein:

based on the first contact being the drain contact and the second contact being the source contact of the transistor, the first distance is higher than the second distance.

7. The semiconductor device of claim 1 , wherein:

the first contact is electrically coupled to a drain region of the first transistor; and

the second contact is electrically coupled to a source region the first transistor.

8. The semiconductor device of claim 7 , wherein the first transistor comprises (i) the drain region, (ii) the first contact coupled to the drain region, (iii) the source region, (iv) the second contact coupled to the source region, and (v) at least the part of the first section of the gate layer.

9. The semiconductor device of claim 1 , wherein:

a first parasitic capacitance is generated between the gate layer and the first contact;

a second parasitic capacitance is generated between the gate layer and the second contact; and

based on the non-linear shape of the gate layer, the first parasitic capacitance is different from the second parasitic capacitance.

10. A semiconductor device comprising:

a first gate layer comprising (i) a first section and (ii) a second section, wherein the first gate layer is non-linear such that the first section of the first gate layer is offset with respect to the second section of the first gate layer;

a first contact and a second contact, wherein the first section of the gate layer is at (i) a first distance from the first contact and (ii) a second distance from the second contact, wherein the first distance is different from the second distance;

a second gate layer, wherein the second gate layer is linearly shaped; and

a third contact,

wherein the second gate layer is at substantially a same distance from each of the second contact and the third contact.

11. A method of forming a semiconductor device, comprising:

forming a gate layer, wherein the gate layer comprises (i) a first section and (ii) a second section, wherein the gate layer is non-linear such that the first section of the gate layer is offset with respect to the second section of the gate layer, and wherein the first section of the gate layer and the second section of the gate layer form a continuous section of the gate layer;

forming a first contact, a second contact, a third contact, and a fourth contact, wherein the first section of the gate layer is at (i) a first distance from the first contact and (ii) a second distance from the second contact, wherein the first distance is different from the second distance, wherein the second section of the gate layer is at a third distance from each of the third contact and the fourth contact;

forming a first transistor such that at least a part of the first section of the gate layer is included in the first transistor; and

forming a second transistor such that at least a part of the second section of the gate layer is included in the second transistor, wherein the second transistor is different from and adjacent to the first transistor.

12. The method of claim 11 , wherein the second section of the gate layer is substantially at a same distance from each of the first contact and the second contact.

13. The method of claim 11 , wherein:

the gate layer further comprises a third section;

the first section of the gate layer is offset with respect to the third section of the gate layer; and

the second section of the gate layer is linear with respect to the third section of the gate layer.

14. The method of claim 11 , further comprising:

forming a drain region of the first transistor, wherein the first contact is a drain contact that is electrically coupled to the drain region; and

forming a source region of the first transistor, wherein the second contact is a source contact that is electrically coupled to the source region,

wherein based on the first contact being the drain contact and the second contact being the source contact of the first transistor, the first distance is higher than the second distance.

15. A method of forming a semiconductor device, comprising:

while designing the semiconductor device, assigning a first value to a flag in a design of the semiconductor device, wherein the flag is associated with a gate layer, and wherein the first value indicates that the gate layer is to be non-linear and to be skewed towards a first contact;

based on the first value being assigned to the flag associated with the gate layer, forming the gate layer such that (i) the gate layer comprises the first section and a second section, (ii) the gate layer is non-linear such that the first section of the gate layer is offset with respect to the second section of the gate layer, and (iii) the first section of the gate layer is skewed towards the first contact; and

forming the first contact and a second contact, wherein the first section of the gate layer is at (i) a first distance from the first contact and (ii) a second distance from the second contact, wherein the first distance is different from the second distance.

16. A method of forming a semiconductor device, comprising:

while designing the semiconductor device and in a design of the semiconductor device, associating a linearity indication layer with a gate layer and a first contact;

based on the linearity indication layer being associated with the gate layer and the first contact, forming the gate layer such that (i) the gate layer comprises the first section and a second section, (ii) the gate layer is non-linear such that the first section of the gate layer is offset with respect to the second section of the gate layer, and (iii) the first section of the gate layer is skewed towards the first contact; and

forming the first contact and a second contact, wherein the first section of the gate layer is at (i) a first distance from the first contact and (ii) a second distance from the second contact, wherein the first distance is different from the second distance.

17. The method of claim 16 , wherein the linearity indication layer comprises an optical proximity correction (OPC) optimization layer.

18. A method of forming a semiconductor device, comprising:

forming a gate layer, wherein the gate layer comprises (i) a first section and (ii) a second section, wherein the gate layer is non-linear such that the first section of the gate layer is offset with respect to the second section of the gate layer; and

forming a first contact and a second contact, wherein the first section of the gate layer is at (i) a first distance from the first contact and (ii) a second distance from the second contact, wherein the first distance is different from the second distance,

wherein forming the gate layer comprises

forming a plurality of diffusion layers,

forming a first layer over the plurality of diffusion layers,

masking at least a part of the first layer using a first mask, wherein a shape of the first mask corresponds to a shape of the gate layer,

subsequent to masking at least the part of the first layer, etching portions of the first layer that is not masked, and

subsequent to etching portions of the first layer, etching the first mask to form the gate layer.

19. A method of forming a semiconductor device, comprising:

forming a gate layer, wherein the gate layer comprises (i) a first section and (ii) a second section, wherein the gate layer is non-linear such that the first section of the gate layer is offset with respect to the second section of the gate layer;

forming a first contact and a second contact, wherein the first section of the gate layer is at (i) a first distance from the first contact and (ii) a second distance from the second contact, wherein the first distance is different from the second distance; and

forming a modified gate layer from the gate layer such that the modified gate layer comprises at least a part of the first section of the gate layer, wherein the modified gate layer does not include the second section of the gate layer.

20. A method of forming a semiconductor device, comprising:

forming a first gate layer, wherein the first gate layer comprises (i) a first section and (ii) a second section, wherein the first gate layer is non-linear such that the first section of the first gate layer is offset with respect to the second section of the first gate layer; and

forming a first contact and a second contact, wherein the first section of the first gate layer is at (i) a first distance from the first contact and (ii) a second distance from the second contact, wherein the first distance is different from the second distance,

forming a second gate layer, wherein the second gate layer is linearly shaped; and

forming a third contact, wherein the second gate layer is at substantially a same distance from each of the second contact and the third contact.